Search Results - "Baks, C.W."

Terabus: Terabit/Second-Class Card-Level Optical Interconnect Technologies by Schares, L., Kash, J.A., Doany, F.E., Schow, C.L., Schuster, C., Kuchta, D.M., Pepeljugoski, P.K., Trewhella, J.M., Baks, C.W., John, R.A., Shan, L., Kwark, Y.H., Budd, R.A., Chiniwalla, P., Libsch, F.R., Rosner, J., Tsang, C.K., Patel, C.S., Schaub, J.D., Dangel, R., Horst, F., Offrein, B.J., Kucharski, D., Guckenberger, D., Hegde, S., Nyikal, H., Chao-Kun Lin, Tandon, A., Trott, G.R., Nystrom, M., Bour, D.P., Tan, M.R.T., Dolfi, D.W.

“…In the "Terabus" optical interconnect program, optical data bus technologies are developed that will support terabit/second chip-to-chip data transfers over…”
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A Single-Chip CMOS-Based Parallel Optical Transceiver Capable of 240-Gb/s Bidirectional Data Rates by Schow, C.L., Doany, F.E., Baks, C.W., Kwark, Y.H., Kuchta, D.M., Kash, J.A.

“…We report here on the design, fabrication, and high-speed performance of a parallel optical transceiver based on a single CMOS amplifier chip incorporating 16…”
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Low-Power 16 x 10 Gb/s Bi-Directional Single Chip CMOS Optical Transceivers Operating at ≪ 5 mW/Gb/s/link by Schow, C.L., Doany, F.E., Chen, C., Rylyakov, A.V., Baks, C.W., Kuchta, D.M., John, R.A., Kash, J.A.

“…We report here on a parallel optical transceiver based on a single 0.13 mum CMOS amplifier chip with 16 transmitter and 16 receiver channels. The transceiver…”
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Determination of the complex permittivity of packaging materials at millimeter-wave frequencies by Zwick, T., Chandrasekhar, A., Baks, C.W., Pfeiffer, U.R., Brebels, S., Gaucher, B.P.

“…The focus of this paper is the determination of the complex permittivity of chip packaging materials at millimeter-wave frequencies. After a broad overview of…”
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160 Gb/s Bidirectional Polymer-Waveguide Board-Level Optical Interconnects Using CMOS-Based Transceivers by Doany, F.E., Schow, C.L., Baks, C.W., Kuchta, D.M., Pepeljugoski, P., Schares, L., Budd, R., Libsch, F., Dangel, R., Horst, F., Offrein, B.J., Kash, J.A.

“…We have developed parallel optical interconnect technologies designed to support terabit/s-class chip-to-chip data transfer through polymer waveguides…”
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Is 25 Gb/s On-Board Signaling Viable? by Kam, D.G., Ritter, M.B., Beukema, T.J., Bulzacchelli, J.F., Pepeljugoski, P.K., Kwark, Y.H., Lei Shan, Xiaoxiong Gu, Baks, C.W., John, R.A., Hougham, G., Schuster, C., Rimolo-Donadio, R., Boping Wu

“…What package improvements are required for dense, high-aggregate bandwidth buses running at data rates beyond 10 Gb/s per channel, and when might optical…”
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A 50 Gb/s NRZ Modulated 850nm VCSEL Transmitter Operating Error Free to 90°C by Kuchta, D.M., Rylyakov, A.V., Schow, C.L., Proesel, J.E., Baks, C.W., Westbergh, Petter, Gustavsson, Johan, Larsson, Anders

“…We report on the properties of an 850nm VCSEL transmitter running at 50Gb/s with NRZ modulation from 30°C to 90°C. This is the highest transmitter operating…”
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70+Gb/s VCSEL-Based Multimode Fiber Links by Kuchta, Daniel M., Rylyakov, Alexander V., Doany, Fuad E., Schow, Clint L., Proesel, Jonathan E., Baks, Christian W., Westbergh, Petter, Gustavsson, Johan S., Larsson, Anders

“…We report on an 850nm VCSEL based link operating error free to 71 Gb/s using an NRZ modulation format. This optical link uses custom transmitter and receiver…”
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Exploring the limits of high-speed receivers for multimode VCSEL-based optical links by Dupuis, N., Kuchta, D. M., Doany, F. E., Rylyakov, A., Proesel, J., Baks, C.W., Schow, C. L., Luong, S., Xie, C., Wang, L., Huang, S., Jackson, K., Li, N. Y.

“…We present complete characterizations of multimode GaAs photodetectors for high-speed VCSEL-based optical links and compare SiGe receiver IC performances in a…”
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Silicon Carrier with Deep Through-Vias, Fine Pitch Wiring and Through Cavity for Parallel Optical Transceiver by Patel, C.S., Tsang, C.K., Schuster, C., Doany, F.E., Nyikal, H., Baks, C.W., Budd, R., Buchwalter, L.P., Andry, P.S., Canaperi, D.F., Edelstein, D.C., Horton, R., Knickerbocker, J.U., Krywanczyk, T., Kwark, Y.H., Kwietniak, K.T., Magerlein, J.H., Rosner, J., Sprogis, E.

“…The design, fabrication, assembly and characterization of a novel silicon carrier package used for enabling a Tb/s parallel optical transceiver is reported…”
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Chip-to-chip optical interconnects by Kash, J.A., Doany, F.E., Schares, L., Schow, C.L., Schuster, C., Kuchta, D.M., Pepeljugoski, P.K., Trewhella, J.M., Baks, C.W., John, R.A., Shan, J.L., Kwark, Y.H., Budd, R.A., Chiniwalla, P., Libsch, F.R., Rosner, J., Tsang, C.K., Patel, C.S., Schaub, J.D., Kucharski, D., Guckenberger, D., Hedge, S., Nyikal, H., Dangel, R., Horst, F., Offrein, B.J., Lin, C.K., Tandon, A., Trott, G.R., Nystrom, M., Bour, D., Tan, M.R.T., Dolfi, D.W.

“…Terabus is based on a silicon-carrier interposer on an organic card containing 48 polymer waveguides. We have demonstrated 4times12 arrays of low power optical…”
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Thermal-mechanical analysis of Terabus high-speed optoelectronic package by Shashikant Hegde, Lei Shan, Kuchta, D.M., Kwark, Y.H., Baks, C.W., Doany, F., Kash, J.A., Trewhella, J.M.

“…Terabus is a high-speed optoelectronic package designed to run at 10-20 Gb/s/channel over 48 channels of optical/electrical links. The Terabus package consists…”
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