Search Results - "Bajpai, Vishnu Kant"

Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications by Kant Bajpai, Vishnu, Kumar Mishra, Dileep, Dixit, Pradeep

“…[Display omitted] •Fabrication of 3D microstructures in glass by lithography-free approach for RF MEMS.•Direct formation of through-holes and embedded…”
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Ultrasonic-assisted surface roughening of glass substrate to improve adhesion of electroless nickel seed layer in microsystems packaging by Bajpai, Vishnu Kant, Pandey, Harsh, Singh, Tarlochan, Dixit, Pradeep

“…•Ultrasonic power rating and abrasive grain size affects the roughness in glass.•Glass substrates having higher roughness has better adhesion with metal…”
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Thin uniform nickel seed layer formation and its impact on Ni-Cu contact adhesion for c-Si solar cell applications by Bajpai, Vishnu Kant, Pant, Prita, Solanki, Chetan Singh

“…[Display omitted] •Demonstrating role of nucleation and growth of Pd nuclei on Ni seed layer characteristics.•∼20nm thin Ni seed layer formation over textured…”
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Direct Solar PV-LED Lighting System by Zachariah, Sachin, Bajpai, Vishnu Kant, Kumar, Venkata Pavan, Solanki, Chetan S

“…With the increasing impact of climate change seen in present decades, an efficient, low cost, low carbon foot print, low embedded energy, and very robust…”
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Junction depth estimation using wet chemical etching for deep junction fabricated by laser doping by Mondal, Som, Bajpai, Vishnu Kant, Solanki, Chetan Singh

“…In this work, a wet chemical etching technique has been used to estimate the depth of a p-n junction. The wet chemical etchant used is HF/HNO 3 /H 2 O…”
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