Search Results - "Bahi, M.A."

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  1. 1
    Sequential environmental stresses tests qualification for automotive components

    Sequential environmental stresses tests qualification for automotive components by Bahi, M.A., Lecuyer, P., Fremont, H., Landesman, J.P.

    Published in Microelectronics and reliability (2007)
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  2. 2
    A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages

    A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages by Auguste, Bahi Manoubi, Hélène, Fremont, Jean-Pierre, Landesman, Annabelle, Gentil, Pascal, Lecuyer

    Published in Microelectronics and reliability (01-09-2009)
    “…We describe a new methodology for the “in situ” identification of wire-bond degradation at early stages during high-temperature aging tests on devices with…”
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    Journal Article Conference Proceeding
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  3. 3
    Sequential environmental stresses tests qualification for automotive components

    Sequential environmental stresses tests qualification for automotive components by Bahi, M.A., Lecuyer, P., Fremont, H., Landesman, J-P.

    Published in Microelectronics and reliability (01-09-2007)
    “…The purpose is to create a new qualification methodology for plastic encapsulated electronic components used in an automotive environment at high temperature…”
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    Journal Article Conference Proceeding
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  4. 4
    Degradation Mechanisms of Au-Al Wire Bonds During Qualification Tests at High Temperature for Automotive Applications: Quality Improvement by Process Modification

    Degradation Mechanisms of Au-Al Wire Bonds During Qualification Tests at High Temperature for Automotive Applications: Quality Improvement by Process Modification by Bahi, M.A., Lecuyer, P., Gentil, A., Fremont, H., Landesman, J.-P., Christien, F., Le Gall, R.

    “…Several package families used in automotive environment were aged at different high temperatures. The purpose was to better characterize the predominant…”
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    Magazine Article
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  5. 5
    Package delamination as indicator of ball bond lift: New diagnostic methodology

    Package delamination as indicator of ball bond lift: New diagnostic methodology by Bahi, M.A., Lecuyer, P., Gentil, A., Fremont, H., Landesman, J.-P.

    “…The components used in the automotive environment are subjected during their lives to various environmental combined stresses. The predominant failure…”
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    Conference Proceeding
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  6. 6
    Bond Reliability Improvement at High Temperature by Pd Addition on Au Bonding Wires

    Bond Reliability Improvement at High Temperature by Pd Addition on Au Bonding Wires by Bahi, M.A., Lecuyer, P., Gentil, A., Fremont, H., Landesman, J.-P., Christien, F.

    “…To extend the qualification domain to the biggest package size in the automotive environment at high temperature, it is necessary to improve the Au-Al bond…”
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  7. 7
    Degradation Mechanisms of Au-Al Wire Bonds During Qualification Tests at High Temperature for Automotive Applications: Quality Improvement by Process Modification

    Degradation Mechanisms of Au-Al Wire Bonds During Qualification Tests at High Temperature for Automotive Applications: Quality Improvement by Process Modification by Bahi, M.A., Lecuyer, P., Gentil, A., Fremont, H., Landesman, J.P., Christien, Frédéric, Le Gall, René

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