Search Results - "Baek, Seungduk"

22.1 A 1.1V 16GB 640GB/s HBM2E DRAM with a Data-Bus Window-Extension Technique and a Synergetic On-Die ECC Scheme by Oh, Chi-Sung, Chun, Ki Chul, Byun, Young-Yong, Kim, Yong-Ki, Kim, So-Young, Ryu, Yesin, Park, Jaewon, Kim, Sinho, Cha, Sanguhn, Shin, Donghak, Lee, Jungyu, Son, Jong-Pil, Ho, Byung-Kyu, Cho, Seong-Jin, Kil, Beomyong, Ahn, Sungoh, Lim, Baekmin, Park, Yongsik, Lee, Kijun, Lee, Myung-Kyu, Baek, Seungduk, Noh, Junyong, Lee, Jae-Wook, Lee, Seungseob, Kim, Sooyoung, Lim, Botak, Choi, Seouk-Kyu, Kim, Jin-Guk, Choi, Hye-In, Kwon, Hyuk-Jun, Kong, Jun Jin, Sohn, Kyomin, Kim, Nam Sung, Park, Kwang-Il, Lee, Jung-Bae

“…Rapidly evolving artificial intelligence (Al) technology, such as deep learning, has been successfully deployed in various applications: such as image…”
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Characterization of Die-to-Wafer Hybrid Bonding using Heterogeneous Dielectrics by Kim, Min-Ki, Park, Soojeoung, Jang, Aeni, Lee, Hyuekjae, Baek, Seungduk, Lee, ChungSun, Kim, Ilhwan, Park, Jumyong, Jee, Youngkun, Kang, Un-Byoung, Kim, Dae-Woo

“…To overcome the technological limitations of existing bonding technology using solder u-bumps, die-to-wafer (D2W) hybrid bonding technology is attracting…”
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A Study on Memory Stack Process by Hybrid Copper Bonding (HCB) Technology by Lee, Sanghoon, Jee, Youngkun, Park, Sangcheon, Lee, Soohwan, Hwang, Bohee, Jo, Gyeongjae, Lee, Chungsun, Park, Jumyong, Jang, Aeni, Jung, HyunChul, Kim, Ilhwan, Kang, Dongwoo, Baek, Seungduk, Kim, Dae-Woo, Kang, Unbyung

“…Hybrid copper bonding (HCB) technology has been introduced and evaluated to overcome a fine pitch limit and degradation in thermal properties in 3D…”
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