Search Results - "Baccus, B."

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  1. 1

    Two-dimensional simulation of local oxidation of silicon: calibrated viscoelastic flow analysis by Senez, V., Collard, D., Ferreira, P., Baccus, B.

    Published in IEEE transactions on electron devices (01-05-1996)
    “…Local Oxidation of Silicon (LOCOS) remains the common isolation technology for mass-production of integrated circuits. The work reported in this paper…”
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    Journal Article
  2. 2

    Mechanical stress analysis of an LDD MOSFET structure by Ferreira, P., Senez, V., Baccus, B.

    Published in IEEE transactions on electron devices (01-09-1996)
    “…This paper presents a mechanical stress study of the LDD MOSFET structure. The stresses are successively evaluated through the forming steps and topological…”
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    Journal Article
  3. 3

    Three-dimensional process simulation by Lorenz, J., Baccus, B., Henke, W.

    Published in Microelectronic engineering (01-12-1996)
    “…Within the JESSI/ESPRIT project PROMPT, a program system for the multidimensional simulation of semiconductor fabrication steps is being developed. The overall…”
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    Journal Article Conference Proceeding
  4. 4

    Influence of the silicon nitride oxidation on the performances of NCLAD isolation by Tixier, A., Senez, V., Baccus, B., Marmiroli, A., Colpani, P., Rebora, A., Carnevale, G.P.

    Published in Microelectronics and reliability (01-05-1998)
    “…In order to study NCLAD isolation structures, a silicon nitride oxidation model has been studied and implemented in the process simulation program IMPACT-4…”
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    Journal Article
  5. 5

    A continuous and general model for boron diffusion during post-implant annealing including damaged and amorphizing conditions by Baccus, B., Vandenbossche, E.

    “…A model is presented for boron diffusion after ion implantation. The aim is to derive a formulation valid for a large range of implantation doses and annealing…”
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    Journal Article
  6. 6

    A study of nonequilibrium diffusion modeling-applications to rapid thermal annealing and advanced bipolar technologies by Baccus, B., Wada, T., Shigyo, N., Norishima, M., Nakajima, H., Inou, K., Iinuma, T., Iwai, H.

    Published in IEEE transactions on electron devices (01-03-1992)
    “…A nonequilibrium diffusion model has been developed to study the influence of point defects on dopant redistribution, especially for transient enhanced…”
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    Journal Article
  7. 7

    Adaptive mesh refinement for multilayer process simulation using the finite element method by Baccus, B., Collard, D., Dubois, E.

    “…An adaptive mesh refinement technique is proposed for a two-dimensional finite-element multilayer process simulator. Mesh refinement is based on the dopant…”
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    Journal Article
  8. 8

    High Concentration Boron Diffusion Study Using A Complete Point Defect And Dynamic Nucleation Model by Vandenbossche, E., Baccus, B.

    “…The diffusion and activation of boron at high concentrations are key problems in designing ultra-shallow P + junctions. In this paper, the behavior of boron…”
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    Conference Proceeding
  9. 9

    Pseudo-analytical modelling of stress dependent silicon oxidation by Collard, D., Baccus, B., Senez, V.

    “…This paper proposes an alternative modelling approach for the inclusion of the stress effects in 2D local oxidation simulations. The stresses induced by the…”
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    Conference Proceeding
  10. 10

    A study of the electrical performances of isolation structures by Dubois, E., Coppee, J.-L., Baccus, B., Collard, D.

    Published in IEEE transactions on electron devices (01-06-1990)
    “…The electrical properties of field oxide isolation structures are investigated from the device physics point of view. The importance of the potential barrier…”
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    Journal Article
  11. 11

    Sensitivity of PNP Doping Profiles to Annealing Conditions - Role of Dynamic Clustering Phenomena by Baccus, B., Vandenbossche, E., Monroy, A., Collard, D., Jaouen, H., Roche, M.

    “…It is well-known that doping profiles of PNP transistors are extremely sensitive to the exact annealing conditions, in particular to the ramp-up procedure…”
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    Conference Proceeding
  12. 12

    Implementation of nitride oxidation in the 2D process simulator IMPACT-4 by Tixier, A., Senez, V., Baccus, B., Marmiroli, A.

    “…To shrink the dimension of devices, new isolation technologies, with respect to classical LOCOS, have to be evaluated. This paper deals with the study of one…”
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    Conference Proceeding
  13. 13

    3-dimensional simulation of thermal diffusion and oxidation processes by Senez, V., Bozek, S., Baccus, B.

    “…Within the frame of the european PROMPT project in which a multidimensional process simulation system has been developed, a new 3D process simulation program…”
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    Conference Proceeding
  14. 14

    Modeling arsenic activation and diffusion during furnace and rapid thermal annealing by Vandenbossche, E., Jaouen, H., Baccus, B.

    “…A model has been developed for arsenic diffusion after ion implantation and validated for a very wide range of annealing conditions including furnace and rapid…”
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    Conference Proceeding
  15. 15

    Simulation of advanced field isolation using calibrated viscoelastic stress analysis by Senez, V., Collard, D., Ferreira, P., Baccus, B.

    “…A physical two-dimensional modeling of the thermal oxidation of silicon has been developed based on the explicit treatment of the reaction expansion. The…”
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    Conference Proceeding
  16. 16

    Electrical Performances Comparison of Semi and Fully Recessed Isolation Structures by Dubois, E., Coppee, J.-L., Baccus, B, Collard, D.

    “…Electrical characteristics of semi-recessed and fully-recessed LOCOS isolation techniques are analyzed. Two-dimensional process/device simulations, performed…”
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    Conference Proceeding
  17. 17

    Mechanical Stress Analysis of a LDD-MOSFET Structure by Ferreira, P., Senez, V., Baccus, B.

    “…A mechanical stress analysis of the LDD-MOSFET structure is presented. It includes the cumulative effects from the oxidation, the thermal cycles and the…”
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    Conference Proceeding
  18. 18

    Domain Decomposition Method Applied to 3D Finite Element Process Simulation by Herbaux, J., Brocard, D., Baccus, B., Senez, V., Bozek, S.

    “…This paper presents a novel approach for solving large sparse linear system arising from 3D finite element process simulation. This new method, also called the…”
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    Conference Proceeding
  19. 19

    Two-Dimensional Modelling of SILO Isolation Structures by Collard, D., Senez, V., Baccus, B.

    “…This paper presents quantitative 2D stress dependent simulations of the Sealed Interface Local Oxidation (SILO) structure. In the SILO structure, the oxidation…”
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    Conference Proceeding
  20. 20

    Study of Local Silicon Oxidation with Calibrated Nitride Model by Ferreira, P., Senez, V., Collard, D., Baccus, B.

    “…Typical 2D effects such as oxide thinning and bird's beak size decrease with nitride masks and windows size reduction are observed in submicron isolation…”
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    Conference Proceeding