Search Results - "BOGGESS, Tom F"

Flip Chip Bonding of 68 x 68 MWIR LED Arrays by CHANDRA DAS, Naresh, TAYSING-LARA, Monica, ANDERSON OLVER, Kimberley, KIAMILEV, Fouad, PRINEAS, J. P, OLESBERG, J. T, KOERPERICK, E. J, MURRAY, L. M, BOGGESS, Tom F

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Flip Chip Bonding of 68 [Formula Omitted] 68 MWIR LED Arrays by Das, N.C, Taysing-Lara, M, Olver, K.A, Kiamilev, F, Prineas, J.P, Olesberg, J.T, Koerperick, E.J, Murray, L.M, Boggess, T.F

“…The flip chip bonding process is optimized by varying the bonding pressure, temperature, and time. The 68times68 mid wave infrared (MWIR) LED array was…”
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Flip Chip Bonding of 68 \times 68 MWIR LED Arrays by Das, N.C., Taysing-Lara, M., Olver, K.A., Kiamilev, F., Prineas, J.P., Olesberg, J.T., Koerperick, E.J., Murray, L.M., Boggess, T.F.

“…The flip chip bonding process is optimized by varying the bonding pressure, temperature, and time. The 68times68 mid wave infrared (MWIR) LED array was…”
Get full text