Search Results - "BLECH, I. A"

Diffusional back flows during electromigration by Blech, I.A.

“…Non-linear drift velocities have been reported when passing electrical currents through short metal lines. The aluminum drift velocity assumes very small…”
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Stress generation by electromigration by Blech, I. A., Herring, Conyers

“…Stresses in aluminum thin films on TiN were studied in situ by transmission x-ray topography. Stress gradients were seen to build up in thin aluminum films…”
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Measurement of stress gradients generated by electromigration by Blech, I. A., Tai, K. L.

“…Stress gradients generated by electromigration in aluminum films were measured at 340 °C. The stresses were measured by combining x-ray topography to record…”
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Formation of titanium silicide films by rapid thermal processing by Powell, R.A., Chow, R., Thridandam, C., Fulks, R.T., Blech, I.A., Pan, J.-D.T.

“…Titanium silicide thin films, sputter deposited from a composite silicide target, have been rapidly sintered in ∼10 s to produce extremely uniform highly…”
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Large deformation of thin films and layered flat panels: effects of gravity by Giannakopoulos, A.E, Blech, I.A, Suresh, S

“…A general theory is presented for the large deformation of thin films and layered flat panels in which gravitational forces have a marked influence on the…”
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The Microstructure of Rapidly Solidified Al6Mn by SHECHTMAN, D, BLECH, I. A

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Chemographic images of silicon surfaces by BLECH, I. A, MEIERAN, E. S

“…Images are obtained when freshly etched or abraded silicon wafers are placed in contact with photographic plates. Based on the study of the images it was…”
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The incubation time for hole formation due to electromigration in Al and Al/Cu/Al thin films by Horowitz, S J, Blech, I A

“…Transmission electron microscope observations of hole formation in Al and Al/Cu/Al thin film conductors carrying high current densities have revealed the…”
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Reminiscences About a Chemistry Nobel Prize Won with Metallurgy: Comments on D. Shechtman and I. A. Blech; Metall. Trans. A, 1985, vol. 16A, pp. 1005–12 by Blech, Ilan A., Cahn, John W., Gratias, Denis

“…Blech, Cahn and Gratias detail their involvement in Nobel-prize-winning papers by Dan Schechtman in which the creation by rapid solidification of a sharply…”
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Multiple Scattering of Neutrons in Vanadium and Copper by Blech, I. A., Averbach, B. L.

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Diffusional back flows during electromigration by Blech, I A

“…Non-linear drift velocities have been reported when passing electrical currents through short metal lines. The aluminum drift velocity assumes very small…”
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The electrical properties of ion-implanted amorphous silicon programmable element in the unprogrammed state by Shacham-Diamand, Y., Sinar, A., Sirkin, E.R., Blech, I.A., Gerzberg, L.

“…An amorphous silicon layer, confined between metal and single-crystalline silicon, is created by the implantation of ions at high dose into silicon wafers…”
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Estudio preliminar de la creación de una “zona caliente” en YBa2Cu3O7-δ utilizando una corriente continua by Evetts, J. E., Blech, I. A., Vázquez-Navarro, M. D.

“…This work presents a study of the processes that give rise to the Direct Current Zoning effect. This effect consists in the formation of a hot zone in a…”
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Some Anomalous Absorption Effects on the Shape of Single-Crystal Rocking Curves by BLECH, I. A., MEIERAN, E. S.

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Long-Range Magnetic Order in MnO by Blech, I. A., Averbach, B. L.

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Linear thermal expansion coefficient and biaxial elastic modulus of diamondlike carbon films by Blech, Ilan A., Wood, Peter

“…Diamondlike carbon films were deposited on silicon, gallium arsenide and aluminum substrates using ion‐assisted chemical vapor deposition. The stress of these…”
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The lectrical properties of ion-implanted amorphous silicon programmable element in the unprogrammed state by SHACHAM-DIAMAND, Y, SINAR, A, SIRKIN, E. R, BLECH, I. A, GERZBERG, L

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Direct Transmission Electron Microscope Observation of Electrotransport in Aluminum Thin Films by Blech, I. A., Meieran, E. S.

“…The process of electrotransport in Al thin films was directly observed by transmission electron microscopy. As expected, it was seen that hole formation…”
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Dis Continuities in Evaporated Aluminum Interconnections by Blech, I. A., Campbell, J. F., Shepherd, W. H.

“…Minute cracks have been observed in semiconductor device metallization at the edges of contact windows. The cracks are formed during deposition of the aluminum…”
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