Search Results - "BIELEFELD, J"
-
1
Fourier transform infrared spectroscopy investigation of chemical bonding in low-k a-SiC:H thin films
Published in Journal of non-crystalline solids (15-07-2011)“…Fourier Transform Infrared (FTIR) Spectroscopy has long been utilized as an analytical technique for qualitatively determining the presence of various…”
Get full text
Journal Article -
2
Mass and bond density measurements for PECVD a-SiCx:H thin films using Fourier transform-infrared spectroscopy
Published in Journal of non-crystalline solids (01-11-2011)“…The absolute concentration of chemical bonds in Plasma Enhanced Chemically Vapor Deposited (PECVD) a-SiCx:H thin films have been determined via combining…”
Get full text
Journal Article -
3
Cardiac Tumors in Infants and Children: Study of 120 Operated Patients
Published in Pediatric cardiology (01-01-2013)“…Cardiac tumors in children are rare, and patient series are limited in size. We report 120 children who underwent surgery to treat a cardiac tumor; the tumor…”
Get full text
Journal Article -
4
Nuclear reaction analysis for H, Li, Be, B, C, N, O and F with an RBS check
Published in Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms (15-03-2016)“…15N nuclear reaction analysis (NRA) for H is combined with 1.2MeV deuteron (D) NRA which provides a simultaneous analysis for Li, Be, B, C, N, O and F. The…”
Get full text
Journal Article -
5
Fracture properties of hydrogenated amorphous silicon carbide thin films
Published in Acta materialia (2012)“…The cohesive fracture properties of hydrogenated amorphous silicon carbide (a-SiC:H) thin films in moist environments are reported. Films with stoichiometric…”
Get full text
Journal Article -
6
Mechanical property changes in porous low- k dielectric thin films during processing
Published in Applied physics letters (13-10-2014)“…The design of future generations of Cu-low-k dielectric interconnects with reduced electronic crosstalk often requires engineering materials with an optimal…”
Get full text
Journal Article -
7
Thermal Conductivity Measurement of Low-k Dielectric Films: Effect of Porosity and Density
Published in Journal of electronic materials (01-03-2014)“…The thermal conductivity of low-dielectric-constant (low- k ) SiOC:H and SiC:H thin films has been measured as a function of porosity using a heat transfer…”
Get full text
Journal Article -
8
Thermal conductivity and sound velocity measurements of plasma enhanced chemical vapor deposited a-SiC:H thin films
Published in Thin solid films (01-09-2011)“…We report ultrafast optical measurements of the thermal conductivity and longitudinal sound velocity for a-SiC:H thin films deposited by plasma enhanced…”
Get full text
Journal Article -
9
Mass and bond density measurements for PECVD a-SiCx:H thin films using Fourier transform-infrared spectroscopy
Published in Journal of non-crystalline solids (01-11-2011)Get full text
Journal Article -
10
Enabling Next Generation 3D Heterogeneous Integration Architectures on Intel Process
Published in 2022 International Electron Devices Meeting (IEDM) (01-01-2022)“…This paper discusses a new generation of heterogeneous integration architectures which we refer to as quasi-monolithic chips (QMC). QMC enables flexible…”
Get full text
Conference Proceeding -
11
Self-Assembly of a Two-Dimensional Superlattice of Molecularly Linked Metal Clusters
Published in Science (American Association for the Advancement of Science) (20-09-1996)“…Close-packed planar arrays of nanometer-diameter metal clusters that are covalently linked to each other by rigid, double-ended organic molecules have been…”
Get full text
Journal Article -
12
Fluidic Self Alignment for Hybrid Bonding Using Intel Process
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28-05-2024)“…Scaling of die-to-wafer hybrid bonding to realize finer interconnects and greater disaggregation requires new solutions for fast bonding with precise…”
Get full text
Conference Proceeding -
13
Case report: Oseltamivir-induced resistant pandemic influenza A (H1N1) Virus infection in a patient with AIDS and Pneumocystis jirovecii pneumonia
Published in Journal of medical virology (01-06-2013)“…Pneumocystis jirovecii pneumonia is the main cause of severe respiratory failure in patients with advanced HIV disease who do not receive P. jirovecii…”
Get full text
Journal Article -
14
Novel use of an Amplatzer Vascular Occluder II to close an acquired fistula between a reconstructed aortic arch and the left atrial appendage in a patient with hypoplastic left heart syndrome
Published in Catheterization and cardiovascular interventions (15-11-2012)“…An 8‐month‐old female with hypoplastic left heart syndrome had undergone bidirectional cavopulmonary anastomosis at the age of 4.5 months and presented with a…”
Get full text
Journal Article -
15
A Selectively Colorful yet Chilly Perspective on the Highs and Lows of Dielectric Materials for CMOS Nanoelectronics
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12-12-2020)“…The remarkable advancement of CMOS electronics over the past two decades has been greatly aided by innovations allowing dielectric scaling across both ends of…”
Get full text
Conference Proceeding -
16
The Pediatrician's Dilemma: Respecting Parental Autonomy Versus Protecting Vulnerable Children
Published in American journal of bioethics (02-01-2016)Get full text
Journal Article -
17
Limits of decoding mental states with fMRI
Published in Cortex (01-04-2022)“…A growing number of studies claim to decode mental states using multi-voxel decoders of brain activity. It has been proposed that the fixed, fine-grained,…”
Get full text
Journal Article -
18
Valence band offset at the amorphous hydrogenated boron nitride-silicon (100) interface
Published in Applied physics letters (23-07-2012)Get full text
Journal Article -
19
Dynamic SPICE-simulation of the electrothermal behavior of SOI MOSFET's
Published in IEEE transactions on electron devices (01-11-1995)“…A nonlinear dynamic electrothermal model of the SOI MOSFET is implemented and used in SPICE3. This model is formulated as a set of algebraic and (partial)…”
Get full text
Journal Article -
20