Search Results - "BAUM, Mario"

Investigation of biocompatible Parylene as triboelectric layer for wearable energy harvesting by Selbmann, Franz, Baum, Mario, Bobinger, Marco, Gottwald, Markus, Wiemer, Maik, Kuhn, Harald

“…Triboelectric nanogenerators (TENGs) are energy converters or energy harvesters that convert mechanical motion into electrical energy on the basis of their…”
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Addiction and Engagement: An Explorative Study Toward Classification Criteria for Internet Gaming Disorder by Lehenbauer-Baum, Mario, Klaps, Armin, Kovacovsky, Zuzana, Witzmann, Karolin, Zahlbruckner, Raphaela, Stetina, Birgit U

“…The DSM-5 introduced Internet gaming disorder (IGD) as a condition needing more research. Proposed criteria include tolerance, preoccupation, deceiving, or…”
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Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding by Tanaka, Koki, Wang, Wei-Shan, Baum, Mario, Froemel, Joerg, Hirano, Hideki, Tanaka, Shuji, Wiemer, Maik, Otto, Thomas

“…To increase the yield of the wafer-level Cu-Cu thermo-compression bonding method, certain surface pre-treatment methods for Cu are studied which can be exposed…”
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Aluminum–germanium wafer bonding of (AlGaIn)N thin-film light-emitting diodes by Goßler, Christian, Kunzer, Michael, Baum, Mario, Wiemer, Maik, Moser, Rüdiger, Passow, Thorsten, Köhler, Klaus, Schwarz, Ulrich T., Wagner, Joachim

“…Eutectic aluminum–germanium wafer bonding was used to fabricate (AlGaIn)N thin-film light-emitting diodes (LEDs). Wafer bonding was carried out on 2″ wafer…”
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Towards classification criteria for internet gaming disorder: Debunking differences between addiction and high engagement in a German sample of World of Warcraft players by Lehenbauer-Baum, Mario, Fohringer, Martina

“…•93.6% play on level 85 in World of Warcraft, only 3.1% are addicted.•We found significant differences between “engaged” and “addicted” gaming…”
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Low-Temperature Wafer Bonding Using Solid-Liquid Inter-Diffusion Mechanism by Froemel, Joerg, Baum, Mario, Wiemer, Maik, Gessner, Thomas

“…The low temperature joining of semiconductor substrates on wafer level by solid-liquid inter-diffusion bonding using the Cu/Ga and Au/In systems is…”
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Aerosol Jet Printing of Nano Particle Based Electrical Chip Interconnects by Seifert, Tobias, Baum, Mario, Roscher, Frank, Wiemer, Maik, Gessner, Thomas

“…Mask less fabricated 3D interconnects may have a big potential in future microelectronic applications by enhancing freedom of device design or power- and…”
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Sealing of glass with titanium by glass pressing at the softening point by Winkler, Sebastian, Edelmann, Jan, Günther, Daniel, Wieland, Sebastian, Selbmann, Franz, Baum, Mario, Schubert, Andreas

“…Hermetic and mechanically strong glass-to-metal seals are required for many applications in technological fields such as aerospace engineering or medical…”
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Aluminum―germanium wafer bonding of (AlGaIn)N thin-film light-emitting diodes : WaferBond'11, International Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration by GOBLER, Christian, KUNZER, Michael, BAUM, Mario, WIEMER, Maik, MOSER, Rüdiger, PASSOW, Thorsten, KÖHLER, Klaus, SCHWARZ, Ulrich T, WAGNER, Joachim

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Inductive Sintering Module for Improved Multi-Die Attach in the Field of Power Packaging by Hofmann, Christian, Rochala, Patrick, Kroll, Martin, Panhale, Sushant, Baum, Mario, Kuhn, Harald, Oi, Kiyoshi, Sanada, Masaki, Murayama, Kei

“…This work presents a heating technology for multi-die attach based on inductive silver sintering. Thus, the heat for the sintering reaction is confined locally…”
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Technologies for Power Device Packaging by Using Solid Liquid Interdiffusion Bonding - SLID by Baum, Mario, Fromel, Jorg, Hofmann, Christian, Wiemer, Maik, Hiller, Karla, Kuhn, Harald

“…This paper presents several approaches for bonding at low temperature with a resulting interface alloy that is stable at temperatures higher than the bonding…”
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Laser soldered wire bonding on liquid printed and sputtered contact structures on thin-flexes and injection molded devices by Fettke, Matthias, Kubsch, Timo, Fisch, Anne, Baa, Mohammed Ziad, Teutsch, Thorsten, Seifert, Tobias, Baum, Mario, Selbmann, Franz, Paul, Soumya Deep, Roscher, Frank, Kreyssig, Kerstin, Wiemer, Maik, Kuhn, Harald

“…Traditional methods of wire bonding do not work well on liquid printed contact layers and soft substrate materials. Laser soldered wire bonding i.e., SB 2 -WB…”
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Parylene as a Dielectric Material for Electronic Applications in Space by Selbmann, Franz, Baum, Mario, Wiemer, Maik, Joseph, Yvonne, Otto, Thomas

“…A necessary coating for so called double layer isolation for electronic boards in space applications is presented within this paper. A Parylene F layer with a…”
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Silver sintering technology based on induction heating for chip level bonding by Hofmann, Christian, Baum, Mario, Satwara, Maulik, Kroll, Martin, Panhale, Sushant, Rochala, Patrick, Paul, Soumya-Deep, Oi, Kiyoshi, Murayama, Kei, Wiemer, Maik, Kuhn, Harald

“…This paper presents a method for rapid and homogeneous induction heating of micro-scaled silver particle layers to support and enhance the bonding process of…”
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Deposition of Parylene C and characterization of its hermeticity for the encapsulation of MEMS and medical devices by Selbmann, Franz, Baum, Mario, Wiemer, Maik, Gessner, Thomas

“…Following the recent trend of miniaturization of MEMS and the approach to improve the comfort of medical implants for patients by reducing their size the…”
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Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications by Zschenderlein, Uwe, Klingler, Markus, Arnold, Jorg, Baum, Mario, Weisbach, Marie, Schaal, Marco, Wunderle, Bernhard

“…The increased attention for sintered silver as die attach attracts also interest in its reliability assessment. Since the porous joint material shows…”
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An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization by Baum, Mario, Saeidi, Nooshin, Vogel, Klaus, Schroeder, Tim, M. Selvam, Karman G., Wiemer, Maik, Otto, Thomas

“…In this paper, we present the design, modeling, fabrication and initial wafer level characterization of Capacitive Micromachined Ultrasound Transducers (CMUTs)…”
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Mechanical characterization of sintered nanoparticles for advanced electrical and thermal joints: σ-ε-transformation in micro bending tests by Zschenderlein, Uwe, Suresh, Karthik, Baum, Mario, Wunderle, Bernhard

“…This paper covers a detailed preliminary study to micro bending tests used to obtain the mechanical properties of nanoparticles as used in advanced electrical…”
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Nanoparticle assembly and sintering towards all-copper flip chip interconnects by Zurcher, Jonas, Yu, Kerry, Schlottig, Gerd, Baum, Mario, Visser Taklo, Maaike M., Wunderle, Bernhard, Warszynski, Piotr, Brunschwiler, Thomas

“…The current feed capability of typical flip chip electrical interconnects is constrained by the solder alloy, as it is more susceptible to electromigration…”
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Temporary wafer bonding - key technology for MEMS devices by Wuensch, Dirk, Purwin, Lina, Buttner, Lars, Martinka, Ronny, Schubert, Ina, Junghans, Romy, Baum, Mario, Wiemer, Maik, Otto, Thomas

“…Back thinning after temporary wafer bonding is a key technology for three dimensional (3D) integration of sensors and electronic components to obtain…”
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