Search Results - "Aziz, M.S. Abdul"

Numerical Analysis of Nozzle Flow and Spray Characteristics from Different Nozzles Using Diesel and Biofuel Blends by Ishak, MHH, Ismail, Farzad, Sharzali Che Mat, Abdullah, M Z, Aziz, Abdul, Idroas, MY

“…In this paper, the discrete phase model (DPM) was introduced to study the fuel injector cavitations process and the macro spray characteristic of three…”
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Heat transfer and deformation analysis of flexible printed circuit board under thermal and flow effects by Lim, Chong Hooi, Abdullah, M.Z, Abdul Azid, I, Khor, C.Y, Abdul Aziz, M.S, Ishaik, M.H.H

“…Purpose The purpose of this study is to investigate heat transfer and deformation of flexible printed circuit board (FPCB) under thermal and flow effects by…”
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Thermal fluid-structure interaction of PCB configurations during the wave soldering process by Abdul Aziz, M.S, Abdullah, M.Z, Khor, C.Y

“…Purpose – This paper aims to investigate the thermal fluid–structure interactions (FSIs) of printed circuit boards (PCBs) at different component configurations…”
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Effects of Temperature on the Wave Soldering of Printed Circuit Boards: CFD Modeling Approach by Aziz, M S Abdul, Abdullah, M Z, Khor, C Y, Ani, F Che, Adam, N H

“…ABSTRACT This study investigated the effects of temperature on the wave soldering of printed circuit boards (PCBs) using three-dimensional finite volume…”
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Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process by Khor, C.Y., Ishak, Muhammad Ikman, Rosli, M.U., Jamalludin, Mohd Riduan, Zakaria, M.S, Yamin, A.F.M., Abdul Aziz, M.S., Abdullah, M.Z.

“…This paper presents the investigation of the effects of epoxy moulding compound’ (EMC) viscosity on the FSI aspects during moulded underfill process (MUF)…”
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Die attachment, wire bonding, and encapsulation process in LED packaging: A review by Alim, Md. Abdul, Abdullah, M.Z., Aziz, M.S. Abdul, Kamarudin, R.

“…[Display omitted] •Review on die attachment, wire bonding and encapsulation process in LED packaging.•Systematically described and compared all the important…”
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Stencil printing process performance on various aperture size and optimization for lead-free solder paste by Rusdi, M. S., Abdullah, M. Z., Chellvarajoo, S., Abdul Aziz, M. S., Abdullah, M. K., Rethinasamy, P., Veerasamy, Sivakumar, Santhanasamy, Damian G.

“…The present study examines the effect of squeegee load, squeegee speed, and separation speed on the printing performance of lead-free solder paste, and solder…”
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Three-dimensional CFD simulation of the stencil printing performance of solder paste by Rusdi, M. S., Abdullah, M. Z., Ishak, M. H. H., Aziz, M. S. Abdul, Abdullah, M. K., Rethinasamy, P., Jalar, A.

“…The first step in the surface mount technology is the printing of the solder paste. The amount of solder placed on the cooper pad is important in guaranteeing…”
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Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board by Lim, C.H., Abdullah, M.Z., Azid, I.A., Abdul Aziz, M.S.

“…The desire of flexibility, compact, lightweight and low cost in current electronic device increases the application of flexible printed circuit board (FPCB)…”
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CFD modeling of pin shape effects on capillary flow during wave soldering by Abdul Aziz, M.S., Abdullah, M.Z., Khor, C.Y., Jalar, A., Che Ani, F.

“…This paper presents an effective numerical method for evaluating the effect of the pin-through-hole (PTH) shape on the soldering stage using wave soldering…”
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Effect of piezoelectric fan mode shape on the heat transfer characteristics by Fairuz, Z.M., Sufian, S.F., Abdullah, M.Z., Zubair, M., Abdul Aziz, M.S.

“…Piezoelectric fans with their low noise and power consumption, are an effective means of enhancing heat transfer and is a viable alternative to the natural…”
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Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach by Aziz, M.S. Abdul, Abdullah, M.Z., Khor, C.Y., Ani, F. Che

“…This paper presents the three-dimensional finite-volume-based simulation of the effects of pin through-hole (PTH) offset position in a wave soldering process…”
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Optimization of pin through hole connector in thermal fluid–structure interaction analysis of wave soldering process using response surface methodology by Abdul Aziz, M.S., Abdullah, M.Z., Khor, C.Y., Azid, I.A.

“…•We carry out the optimization of pin through hole in the wave soldering process.•Real-time thermal FSI analysis is performed by using FLUENT, ABAQUS and…”
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Influence of solder bump arrangements on molded IC encapsulation by Khor, C.Y., Abdullah, M.Z., Lau, Chun-Sean, Leong, W.C., Abdul Aziz, M.S.

“…[Display omitted] •The scaled-up IC encapsulation was carried out to validate the numerical studies.•A total of five models with solder bump arrangements were…”
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A computational fluid dynamics analysis of the wave soldering process by Abdul Aziz, M.S, Abdullah, M.Z, Khor, C.Y, Mazlan, M, Iqbal, A.M, Fairuz, Z.M

“…Purpose – The purpose of this paper is to present a three-dimensional finite volume-based analysis on the effects of propeller blades on fountain flow in a…”
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Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis by Abdul Aziz, M. S., Khor, C. Y., Abdullah, M. Z.

“…An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole…”
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A computational fluid dynamics analysis of the wave soldering process: Influence of propeller blades on fountain flow by Abdul Aziz, M.S., Abdullah, M.Z., Khor, C.Y., Mazlan, M., Iqbal, A.M., Fairuz, Z.M.

“…Purpose – The purpose of this paper is to present a three-dimensional finite volume-based analysis on the effects of propeller blades on fountain flow in a…”
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Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering by Aziz, M. S. Abdul, Abdullah, M. Z., Khor, C. Y., Fairuz, Z. M., Iqbal, A. M., Mazlan, M., Rasat, Mohd Sukhairi Mat

“…An effective simulation approach is introduced in this paper to study the thermal fluid-structure interaction (thermal FSI) on the effect of pin-through-hole…”
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