Search Results - "Aw, Jerry Jie Li"

Miniaturized Double Side Cooling Packaging for High Power 3 Phase SiC Inverter Module with Junction Temperature over 220°C by Woo, Daniel Rhee Min, Hwang How Yuan, Li, Jerry Aw Jie, Lee Jong Bum, Zhang Hengyun

“…In this paper, authors developed miniaturizeddouble side cooling packaging for SiC (silicon carbide) highpower inverter module using new material solutions…”
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Thermal modeling and characterization of SiC power module under both air cooling and liquid cooling conditions by Zhang, Hengyun, Hwang, How Yuan, Bu, Lin, Aw, Jerry Jie Li, Rhee, Daniel Min Woo

“…Silicon carbide based power modules are receiving more attention due to their performance advantages over traditional silicon power modules. The demanding…”
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Process development of multi-die stacking using 20 um pitch micro bumps on large scale dies by Lee Jong Bum, Li, Jerry Aw Jie, Woo, Daniel Rhee Min

“…In the 3D integration, multiple chip stacking structure requires large numbers of interconnections inside of each chip. 3D integration, however, encounters…”
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High power SiC inverter module packaging solutions for junction temperature over 220°C by Woo, Daniel Rhee Min, Hwang How Yuan, Li, Jerry Aw Jie, Ho Siow Ling, Lee Jong Bum, Zhang Songbai, Zhang Hengyun, Selvaraj, Susai Lawrence, Velez, Sorono Dexter, Singh, Ravinder Pal

“…The SiC based high power 3 phase inverter module with double side cooling structure was developed. By applying flipchip bonding of SiC based high power DMOSFET…”
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Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking by Ling Xie, Wickramanayaka, Sunil, Boo Yung Jung, Li, Jerry Aw Jie, Lim Jung-kai, Ismael, Daniel

“…A wafer level under-fill (WLUF) process for ultra-fine Cu-Cu bonding is developed. Under-fill is applied as pre-applied under-fill then planarized the surface…”
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Implantable blood flow sensor integrated on flexible circuit for vascular graft application by Li Shiah Lim, Jia Hao Cheong, Jerry, J. L. A., He, C.

“…This paper reports an implantable blood flow sensor system integrated on flexible circuit that consists of pressure sensor and inductively powered wireless…”
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