Search Results - "Augendre, E."
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Electrically driven hybrid Si/III-V Fabry-Pérot lasers based on adiabatic mode transformers
Published in Optics express (23-05-2011)“…We report the first demonstration of an electrically driven hybrid silicon/III-V laser based on adiabatic mode transformers. The hybrid structure is formed by…”
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2
Crossover from spin accumulation into interface states to spin injection in the germanium conduction band
Published in Physical review letters (07-09-2012)“…Electrical spin injection into semiconductors paves the way for exploring new phenomena in the area of spin physics and new generations of spintronic devices…”
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3
Electrical spin injection and detection at Al2O3/ n -type germanium interface using three terminal geometry
Published in Applied physics letters (17-10-2011)“…In this letter, we report on electrical spin injection and detection in n-type germanium-on-insulator using a Co/Py/Al2O3 spin injector and 3-terminal…”
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4
"Linear kink effect" induced by electron valence band tunneling in ultrathin gate oxide bulk and SOI MOSFETS
Published in IEEE transactions on electron devices (01-07-2003)“…In this paper, evidence will be provided for the existence of a new class of floating body effects, occurring in SOI and bulk MOSFETs in the linear operation…”
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5
Electrically driven hybrid Si/III-V Fabry-Pérot lasers based on adiabatic mode transformers
Published in Optics express (23-05-2011)Get full text
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6
Efficient coupler between silicon photonic and metal-insulator-silicon-metal plasmonic waveguides
Published in Applied physics letters (17-12-2012)“…We report the experimental realization of a compact, efficient coupler between silicon waveguides and vertical metal-insulator-silicon-metal (MISM) plasmonic…”
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7
Electrical and thermal spin accumulation in germanium
Published in Applied physics letters (09-07-2012)“…In this letter, we first show electrical spin injection in the germanium conduction band at room temperature and modulate the spin signal by applying a gate…”
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8
A Reliable Metric for Mobility Extraction of Short-Channel MOSFETs
Published in IEEE transactions on electron devices (01-10-2007)“…When comparing the extracted carrier mobility of long- and short-channel transistors, special consideration must be given to the metallurgical gate length (L…”
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9
Low-temperature characterization and modeling of advanced GeOI pMOSFETs: Mobility mechanisms and origin of the parasitic conduction
Published in Solid-state electronics (01-02-2010)“…We present the fabrication and characterization of Fully-Depleted pMOSFETs processed on ultra-thin GeOI (Germanium-On-Insulator) wafers obtained by the…”
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10
Groups III and V impurity solubilities in silicon due to laser, flash,and solid-phase-epitaxial-regrowth anneals
Published in Applied physics letters (14-08-2006)“…In this work the authors studied impurity solubilities of groups III and V elements in silicon resulting from laser anneal, flash anneal, and…”
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11
Detailed investigation of effective field, hole mobility and scattering mechanisms in GeOI and Ge pMOSFETs
Published in Solid-state electronics (01-05-2011)“…► In depth characterization of fully-depleted pMOSFET on GeOI substrates. ► A methodology to extract the empirical factor on FD-GeOI is proposed. ► We…”
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Journal Article Conference Proceeding -
12
High performance 70 nm gate length germanium-on-insulator pMOSFET with high- k/metal gate
Published in Solid-state electronics (01-07-2009)“…We demonstrate for the first time 70 nm gate length TiN/HfO 2 pMOSFETs on 200 mm GeOI wafers, with excellent performance: I ON = 260 μA/μm and I OFF = 500…”
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Journal Article Conference Proceeding -
13
Improved GeOI substrates for pMOSFET off-state leakage control
Published in Microelectronic engineering (01-07-2009)“…The origin of parasitic leakage that occurs in some GeOI pMOSFETs has been investigated and located at the Ge-buried oxide (BOX) interface. Silicon passivation…”
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Journal Article Conference Proceeding -
14
Characterization of impact of process options in Germanium-On-Insulator (GeOI) high-k & metal gate pMOSFETs by low-frequency noise
Published in Solid-state electronics (01-05-2011)“…► Low frequency noise (LFN) is measured at front and back interfaces of GeOI pMOSFETs. ► Three types of As ion implantation and four types of halo implantation…”
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Journal Article Conference Proceeding -
15
Investigation of 1/ f noise in germanium-on-insulator 0.12 μm PMOS transistors from weak to strong inversion
Published in Solid-state electronics (01-12-2009)“…This paper presents an experimental analysis of the noise measurements performed in germanium-on-insulator (GeOI) 0.12 μm PMOS transistors from weak to strong…”
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16
UTBB FDSOI scaling enablers for the 10nm node
Published in 2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) (01-10-2013)“…UTBB FDSOI technology is a faster, cooler and simpler technology addressing the performance/energy consumption trade-off. In this paper we present the main…”
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Conference Proceeding -
17
Experimental Evidence of Sidewall Enhanced Transport Properties of Mesa-Isolated (001) Germanium-On-Insulator pMOSFETs
Published in IEEE transactions on electron devices (01-12-2009)“…In this brief, the hole transport properties of narrow-width germanium-on-insulator (GeOI) pMOSFETs are investigated. We report, for the first time, +65%…”
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18
Germanium oxynitride (GeOxNy) as a back interface passivation layer for Germanium-on-insulator substrates
Published in Applied physics letters (14-07-2008)“…This paper describes the development of a GeOxNy surface passivation of germanium, which is mandatory for microelectronics germanium-on-insulator (GeOI)…”
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A comparative 1/ f noise study of GeOI wafers obtained by the Ge enrichment technique and the Smart Cut technology
Published in Microelectronic engineering (01-07-2011)“…This paper presents an experimental investigation of Low-frequency Noise (LFN) measurements on Germanium-On-Insulator (GeOI) PMOS transistors processed on…”
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Journal Article Conference Proceeding -
20
Advanced CMOS device technologies for 45 nm node and below
Published in Science and technology of advanced materials (01-01-2007)“…We review and discuss the latest developments and technology options for 45 nm node and below, with scaled planar bulk MOSFETs and MuGFETs as emerging devices…”
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