Search Results - "Arisumi, O"
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Suppression of the floating-body effect in partially-depleted SOI MOSFETs with SiGe source structure and its mechanism
Published in IEEE transactions on electron devices (01-12-1997)“…SiGe layers were formed in source regions of partially-depleted 0.25-/spl mu/m SOI MOSFETs by Ge implantation, and the floating-body effect was investigated…”
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2
Characteristics of an Oxygen Barrier Based on Bi-layered Ir
Published in Integrated ferroelectrics (01-01-2003)“…For high-density ferroelectric random access memory devices (FeRAMs) with capacitor over plug (COP) structure, oxygen diffusion barriers based on bi-layered Ir…”
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Oxygen Diffusion Barriers for High-Density FeRAMs
Published in Integrated ferroelectrics (01-01-2002)“…For high-density ferroelectric random access memories (FeRAMs) with capacitor over plug (COP) structure, oxygen diffusion barriers have been investigated. This…”
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Journal Article -
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Suppression of the floating-body effect in SOI MOSFET's by the bandgap engineering method using a Si/sub 1-x/Ge/sub x/ source structure
Published in IEEE transactions on electron devices (01-03-1997)“…The bandgap engineering method using a SiGe source structure is presented as a means to suppress the floating-body effect in SOI MOSFET's. Experiments using Ge…”
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Journal Article -
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Mechanism of the suppression of the floating-body effect for SOI MOSFETs with SiGe source structure
Published in 1996 IEEE International SOI Conference Proceedings (1996)“…SiGe layers were formed in source regions of partially depleted 0.25 /spl mu/m SOI nMOSFETs with the Ge implantation technique and the floating-body effect was…”
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Conference Proceeding -
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FERROELECTRIC PROPERTIES OF Pb(Zr, Ti)O3 CAPACITOR WITH THIN SrRuO3 FILMS WITHIN BOTH ELECTRODES
Published in Jpn.J.Appl.Phys ,Part 1. Vol. 39, no. 4B, pp. 2110-2113. 2000 (01-01-2000)“…Ferroelectric properties of a Pb(Zi, Ti)O3 (PZT) capacitor with thin SrRuO3 (SRO) films within both electrodes were investigated in detail. Thin SRO films of…”
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LEAD CONTENT CONTROL IN (Pb, La)(Zr, Ti)O3 FILMS USING Ar/O2 SEQUENTIAL RAPID THERMAL PROCESS
Published in Jpn.J.Appl.Phys ,Part 1. Vol. 43, no. 2, pp. 695-698. 2004 (01-02-2004)“…A new method of controlling the Pb profile in (Pb, La)(Zr, Ti)O3 (PLZT) capacitor films with top and bottom SrRuO3 (SRO) electrodes has been developed using an…”
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Lead Content Control in (Pb, La)(Zr, Ti)O 3 Films Using Ar/O 2 Sequential Rapid Thermal Process
Published in Japanese Journal of Applied Physics (01-02-2004)Get full text
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NOVEL Pb(Ti, Zr)O3(PZT) CRYSTALLIZATION TECHNIQUE USING FLASH LAMP FOR FERROELECTRIC RAM (FERAM) EMBEDDED LSIs AND ONE TRANSISTOR TYPE FERAM DEVICES
Published in Jpn.J.Appl.Phys ,Part 1. Vol. 41, no. 4B, pp. 2630-2634. 2002 (01-04-2002)“…A novel method of ferroelectric capacitor formation for Ferroelectric random access memory (FeRAM) embedded LSIs and one-transistor-type FeRAMs has been…”
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Journal Article -
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Suppression of the floating-body effect in SOI MOSFET' s by thebandgap engineering method using a Si(1-x)Ge(x) sourcestructure
Published in IEEE transactions on electron devices (01-03-1997)“…The bandgap engineering method using a SiGe source structure is presented as a means to suppress the floating-body effect in SOI MOSFET's. Experiments using Ge…”
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Journal Article -
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Development of stable PZT sputtering process using ex-situ crystallization and PZT/Pt interface control technique
Published in ISAF 1998. Proceedings of the Eleventh IEEE International Symposium on Applications of Ferroelectrics (Cat. No.98CH36245) (1998)“…Precise control of Pb content in sputter-deposited amorphous PZT films was achieved by optimization of substrate temperature; substrate and shield potential,…”
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Conference Proceeding -
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Analysis of Si-Ge source structure in 0.15 μm SOI MOSFETs using two-dimensional device simulation
Published in Japanese journal of applied physics (01-02-1996)Get full text
Conference Proceeding -
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Formation of SiGe source/drain using Ge implantation for floating-body effect resistant SOI MOSFETs
Published in Japanese Journal of Applied Physics (1996)“…SiGe was formed by Ge implantation into silicon on insulator (SOI) substrates with the dosage range from 0.5 to 3×10 16 cm -2 and subsequent annealing in N 2…”
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Conference Proceeding Journal Article -
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Bandgap engineering technology for suppressing the substrate-floating-effect in 0.15 /spl mu/m SOI-MOSFETs
Published in 1995 IEEE International SOI Conference Proceedings (1995)“…The substrate floating effect is the most fundamental problem in SOI-MOSFETs. Conventional countermeasures, such as body-contact, LDD structure are accompanied…”
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Conference Proceeding