Search Results - "Andriani, Yosephine"

Degradable Poly(alkyl acrylates) with Uniform Insertion of Ester Bonds, Comparing Batch and Semibatch Copolymerizations by Lena, Jean-Baptiste, Jackson, Alexander W, Chennamaneni, Lohitha Rao, Wong, Chiong Teck, Lim, Freda, Andriani, Yosephine, Thoniyot, Praveen, Van Herk, Alexander M

“…Poly­(alkyl)­acrylates are a major class of nonbiodegradable polymers which are difficult to recycle due to an all-carbon backbone. Introducing a certain…”
Get full text

Selective interactions of glycidylamine epoxy/boron nitride nanosheets as a facile method to reinforce bisphenol-A epoxy resins by Andriani, Yosephine, Song, Jing, Seng, Debbie Hwee Leng, Lim, Poh Chong, Teo, Siew Lang, Hui, Hui Kim, Kong, Junhua, Wang, Xiaobai, Yue, Yifan, Zhang, Xiaowu, Liu, Songlin

“…The nanofiller/polymer interfacial compatibility is a crucial factor for maximizing the reinforcing effect of nanofillers in a polymer matrix. In this work, we…”
Get full text

Green and efficient production of boron nitride nanosheets via oxygen doping-facilitated liquid exfoliation by Andriani, Yosephine, Song, Jing, Lim, Poh Chong, Seng, Debbie Hwee Leng, Lai, Doreen Mei Ying, Teo, Siew Lang, Kong, Junhua, Wang, Xiaobai, Zhang, Xiaowu, Liu, Songlin

“…As the structural analogue of graphene, boron nitride nanosheets (BNNSs) are anticipated to have a wide range of potential applications. BNNSs exhibit good…”
Get full text

Structure–Property Relationships in Biomedical Thermoplastic Polyurethane Nanocomposites by Osman, Azlin F, Edwards, Grant A, Schiller, Tara L, Andriani, Yosephine, Jack, Kevin S, Morrow, Isabel C, Halley, Peter J, Martin, Darren J

“…Polyurethanes are excellent potential materials for the construction of implantable medical components due to their exceptional mechanical properties and…”
Get full text

Effect of Boron Nitride Nanosheets on Properties of a Commercial Epoxy Molding Compound Used in Fan-Out Wafer-Level Packaging by Andriani, Yosephine, Wang, Xiaobai, Seng, Debbie Hwee Leng, Teo, Siew Lang, Liu, Songlin, Lau, Boon Long, Zhang, Xiaowu

“…In this article, the effect of incorporating boron nitride nanosheets (represented as BNNSs in this article) in a commercial epoxy molding compound (EMC) that…”
Get full text

Effect of Thermal Cycling on the Thermal and Mechanical Properties of Dielectric Materials by Wang, Xiaobai, Andriani, Yosephine, Lim, Poh Chong, Lee, Coryl Jing Jun, Liu, Songlin, Lau, Boon Long, Zhang, Xiaowu

“…Photosensitive polymers or dielectric materials such as polyimides (PIs) have been used in fan-out wafer-level packaging process (FOWLP) as a redistribution…”
Get full text

Designing nanoporosity in a swollen polymer for the controlled release of a highly volatile fragrance by Chen, Xinwei, Bhardwaj, Ankit, Sharifah, Nursyahirah Syed Isha, Zhang, Liling, Man, Shu Mei, Andriani, Yosephine, Tan, Wui Siew

“…Controlling the fragrance release profile, especially the highly volatile top note, can prolong the desired scent of the fragrance. Here, the porosity of a…”
Get full text

Polyurethane acrylates as effective substrates for sustained in vitro culture of human myotubes by Andriani, Yosephine, Chua, Jason Min-Wen, Chua, Benjamin Yan-Jiang, Phang, In Yee, Shyh-Chang, Ng, Tan, Wui Siew

“…[Display omitted] Muscular disease has debilitating effects with severe damage leading to death. Our knowledge of muscle biology, disease and treatment is…”
Get full text

In vitro biostability of poly(dimethyl siloxane/hexamethylene oxide)-based polyurethane/layered silicate nanocomposites by Andriani, Yosephine, Morrow, Isabel C., Taran, Elena, Edwards, Grant A., Schiller, Tara L., Osman, Azlin F., Martin, Darren J.

“…We have prepared a number of silicone-based thermoplastic polyurethane (TPU) nanocomposites and demonstrated an enhancement of in vitro biostability against…”
Get full text

Organization of mixed dimethyldioctadecylammonium and choline modifiers on the surface of synthetic hectorite by Andriani, Yosephine, Jack, Kevin S., Gilbert, Elliot P., Edwards, Grant A., Schiller, Tara L., Strounina, Ekaterina, Osman, Azlin F., Martin, Darren J.

“…•Dual-modified organoclays have demonstrated advantages in nanocomposites.•The characterization of dual-modified organoclays is thus crucial yet…”
Get full text

Thermomechanical and Viscoelastic Properties of Dielectric Materials Used in Fan-Out Wafer-Level Packaging by Andriani, Yosephine, Wang, Xiaobai, Liu, Songlin, Chen, Zhaohui, Zhang, Xiaowu

“…The fan-out wafer-level packaging (FOWLP) has gained significant interests owing to the cost effectiveness, high performance, high I/O density, high…”
Get full text

Dynamic Mechanical Analysis and Viscoelastic Behavior of Epoxy Molding Compounds Used in Fan-Out Wafer-Level Packaging by Wang, Xiaobai, Andriani, Yosephine, Liu, Songlin, Chen, Zhaohui, Zhang, Xiaowu

“…In decades of microelectronic devices manufacturing, a few generations of epoxy molding compounds (EMCs) have been developed and applied successfully in…”
Get full text

In-situ Cure Shrinkage Characterization of Epoxy Molding Compounds for Fan-Out Wafer-Level Packaging by Wang, Xiaobai, Andriani, Yosephine, Liu, Songlin, Chen, Zhaohui, Zhang, Xiaowu

“…Wafer warpage has remained as a big issue in the semiconductor industry due to the defects it may cause, such as delamination and cracks in the molded devices…”
Get full text

Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP) by Zhang, Xiaowu, Lau, Boon Long, Han, Yong, Chen, Haoran, Jong, Ming Chinq, Lim, Sharon Pei Siang, Lim, Simon Siak Boon, Wang, Xiaobai, Andriani, Yosephine, Liu, Songlin

“…In this paper, we present the design and fabrication of a mold-1 st FOWLP that seeks to solve potential warpage and reliability issues. We examined three…”
Get full text

Thermo-Mechanical and Viscoelastic Properties of an Underfill Material for RDL-First Process by Wang, Xiaobai, Andriani, Yosephine, Tan, Sze Yu, Koh, Xue Qi, Liu, Songlin, Chen, Zhaohui, Zhang, Xiaowu

“…Underfill material has been a significant component of microelectronic packaging for decades. It has been successfully used in the flip-chip (FC) process, and…”
Get full text

Board Level Solder Joint Reliability Design and Analysis of FOWLP by Zhang, Xiaowu, Lau, Boon Long, Chen, Haoran, Han, Yong, Jong, Ming Chinq, Lim, Sharon Pei Siang, Lim, Simon Siak Boon, Wang, Xiaobai, Andriani, Yosephine, Liu, Songlin

“…This paper presents a comprehensive board level solder joint reliability study under thermal cycling (TC) loading by both numerical simulation and experimental…”
Get full text

Wafer Level Warpage Modelling and Validation for FOWLP Considering Effects of Viscoelastic Material Properties Under Process Loadings by Chen, Zhaohui, Zhang, Xiaowu, Lim, Sharon Pei Siang, Lim, Simon Siak Boon, Lau, Boon Long, Han, Yong, Jong, Ming Chinq, Liu, Songlin, Wang, Xiaobai, Andriani, Yosephine

“…Wafer level warpage model was developed for the 12 inch mold-first FOWLP wafer with model change technique. The sequential process loadings of post-mold curing…”
Get full text

Comprehensive Design and Analysis of Fan-Out Wafer Level Package by Zhang, Xiaowu, Andriani, Yosephine, Jong, Ming Chinq, Bu, Lin, Lau, Boon Long, Boon, Simon Lim Siak, Siang, Sharon Lim Pei, Han, Yong, Liu, Songlin, Wang, Xiaobai

“…This paper presents an advanced modeling technology on wafer warpage after post mold curing (PMC) for the 12 inch mold-1 st Fan-Out Wafer Level Packaging…”
Get full text

Solder Joint Reliability Simulation of Fan-out Wafer Level Package (FOWLP) Considering Viscoelastic Material Properties by Chen, Zhaohui, Zhang, Xiaowu, Lim, Sharon Pei Siang, Lim, Simon Siak Boon, Lau, Boon Long, Han, Yong, Jong, Ming Chinq, Liu, Songlin, Wang, Xiaobai, Andriani, Yosephine

“…In this paper, the solder joint reliability under -40^{\circ} \mathrm{C} -125^{\circ}\mathrm{C} thermal cycling loading of different package sizes of…”
Get full text

Package Level Warpage Simulation of Fan-out Wafer Level Package (FOWLP) Considering Viscoelastic Material Properties by Chen, Zhaohui, Zhang, Xiaowu, Lim, Sharon Pei Siang, Lim, Simon Siak Boon, Lau, Boon Long, Han, Yong, Jong, Ming Chinq, Liu, Songlin, Wang, Xiaobai, Andriani, Yosephine

“…In this paper, the package level warpage of different package sizes of mold-first and redistribution layer-first (RDL-first) Fan-out wafer level package…”
Get full text