Life-cycle energy demand comparison of medium voltage Silicon IGBT and Silicon Carbide MOSFET power semiconductor modules in railway traction applications
Power semiconductors process roughly 70 % of global energy, with a higher percentage expected as worldwide transport electrification, renewables and wide-band-gap (WBG) semiconductors are implemented, significantly affecting global energy savings. This manuscript evaluates the cumulative energy dema...
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Published in: | Power electronic devices and components Vol. 6; p. 100050 |
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Main Authors: | , , , |
Format: | Journal Article |
Language: | English |
Published: |
Elsevier
01-10-2023
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Subjects: | |
Online Access: | Get full text |
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Summary: | Power semiconductors process roughly 70 % of global energy, with a higher percentage expected as worldwide transport electrification, renewables and wide-band-gap (WBG) semiconductors are implemented, significantly affecting global energy savings. This manuscript evaluates the cumulative energy demand (CED) encompassing the manufacture and use-phase in a railway traction application of silicon (Si) and silicon carbide (SiC) power semiconductor modules. Realistic manufacturing data from a power semiconductor fab has been considered for 3.3 kV/450 A state-of-the-art Si and SiC LinPak modules. SiC devices presented around 2.6 – 3.8× higher CED per area than Si devices in the manufacturing phase. However, due to the considerably smaller SiC chip area per ampere required, a 1.1 – 1.6× lower grey energy than Si technology is estimated. For the first time, such analysis is based on specialized power semiconductor fab data for both technologies and provides a baseline for the life cycle energy assessment of power electronics systems. Besides, the use-phase energy losses were evaluated for a realistic railway application, considering an operational lifetime of 30 years. The module manufacturing energy is negligible compared to the use-phase stage. Furthermore, the SiC technology presented an estimated energy-saving potential of 24 MWh/lifetime per module compared to the Si device. |
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ISSN: | 2772-3704 2772-3704 |
DOI: | 10.1016/j.pedc.2023.100050 |