Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection applications for the optoelectronic technology consortium (OETC)

A parallel, 32-channel, high density (140 /spl mu/m pitch), 500 Mb/s NRZ, point-to-point, optical data link has been fabricated using existing GaAs IC, silicon optical bench (SiOB), and multichip module (MCM-D) technologies. The main components of the transmitter and the receiver modules are a GaAs-...

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Bibliographic Details
Published in:	Journal of lightwave technology Vol. 13; no. 6; pp. 995 - 1016
Main Authors:	Yiu-Man Wong, Muehlner, D.J., Faudskar, C.C., Buchholz, D.B., Fishteyn, M., Brandner, J.L., Parzygnat, W.J., Morgan, R.A., Mullally, T., Leibenguth, R.E., Guth, G.D., Focht, M.W., Glogovsky, K.G., Zilko, J.L., Gates, J.V., Anthony, P.J., Tyrone, B.H., Ireland, T.J., Lewis, D.H., Smith, D.F., Nati, S.F., Lewis, D.K., Rogers, D.L., Aispain, H.A., Gowda, S.M., Walker, S.G., Kwark, Y.H., Bates, R.J.S., Kuchta, D.M., Crow, J.D.
Format:	Journal Article
Language:	English
Published:	New York, NY IEEE 01-06-1995 Institute of Electrical and Electronics Engineers
Subjects:	Applied sciences Circuit properties Electric, optical and optoelectronic circuits Electronics Exact sciences and technology Miscellaneous Optical and optoelectronic circuits Optical arrays Optical devices Optical fiber cables Optical films Optical receivers Optical signal processing Optical transmitters Packaging Stimulated emission Vertical cavity surface emitting lasers Encapsulation System architecture Binary compound Function block diagram Circuit design Multichip module Bit error rate Crosstalk Eye diagram Photodetectors Experimental study MSM structure III-V compound Integrated circuits Gallium Arsenides Vertical cavity laser Optical interconnects MESFET devices Surface emitting laser Optical characteristic Time curve Data link Electrical characteristic Production process
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Summary:	A parallel, 32-channel, high density (140 /spl mu/m pitch), 500 Mb/s NRZ, point-to-point, optical data link has been fabricated using existing GaAs IC, silicon optical bench (SiOB), and multichip module (MCM-D) technologies. The main components of the transmitter and the receiver modules are a GaAs-based vertical cavity surface emitting laser (VCSEL) array at 850 mn with its IC driver array chip and an integrated metal-semiconductor-metal (MSM) receiver (photodetector and signal processing circuits) array at 850 nm. The package module uses a modified 164 I/O JEDEC premolded plastic quad flat pack (PQFP) in combination with a polymer film integrated circuit (POLYFIC) chip carrier. The electrical input and output are 500 Mb/s NRZ binary signals. The optical I/O in both modules consists of a directly-connectorized (nonpigtail) fiber array block that plugs into the 32/spl times/1 optical fiber ribbon directly on one side and accepts 32 optical signals from the SEL array or delivers them to the MSM receiver array via a gold-coated 45/spl deg/ polished fiber array mirror. The MACII-32 ribbon cable is an enhanced version of the standard MACII connector ribbon cable. This paper characterizes key components of the optical data link, describes its package design, and discusses preliminary component and optical data link test results.< >
Bibliography:	ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23
ISSN:	0733-8724 1558-2213
DOI:	10.1109/50.390217