Search Results - "Afshari, B."

Algebraic connectivity of the second power of a graph by Afshari, B.

“…Denote the Laplacian of a graph G $G$ by L(G) $L(G)$ and its second smallest Laplacian eigenvalue by λ2(G) ${\lambda }_{2}(G)$. If G $G$ is a graph on n≥2…”
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A note on the algebraic connectivity of a graph and its complement by Afshari, B., Akbari, S.

“…For a graph G, let denote its second smallest Laplacian eigenvalue. It was conjectured that , where is the complement of G. In this paper, it is shown that …”
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Lower bounds for the Laplacian spectral radius of graphs by Afshari, B., Saadati, M.T., Saadati, R.

“…Let G=(V,E) be a graph of order n and with the Laplacian spectral radius λ(G). For vi∈V, denote the set of all neighbors of vi by Ni and its number by di. The…”
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Preparation and characterization of Zr and Sn doped TiO2 nanocomposite and photocatalytic activity in degradation of tetracycline by Pouretedal, H.R., Afshari, B.

“…The photocatalysts of Ti0.9Zr0.03Sn0.07O2, Ti0.9Zr0.05Sn0.05O2, and Ti0.9Zr0.07Sn0.03O2 nanocomposite were prepared using the sol–gel method. The structure of…”
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Preparation and characterization of Zr and Sn doped TiO sub(2) nanocomposite and photocatalytic activity in degradation of tetracycline by Pouretedal, H R, Afshari, B

“…The photocatalysts of Ti sub(0.9)Zr sub(0.03)Sn sub(0.07)O sub(2), Ti sub(0.9)Zr sub(0.05)Sn sub(0.05)O sub(2), and Ti sub(0.9)Zr sub(0.07)Sn sub(0.03)O sub(2)…”
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Algebraic connectivity of the second power of a graph by Afshari, B

“…Denote the Laplacian of a graph $G$ by $L(G)$ and its second smallest Laplacian eigenvalue by $\lambda_2(G)$. If $G$ is a graph on $n\ge 2$ vertices, then it…”
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Cyclic proofs for the first-order µ-calculus by Afshari, Bahareh, Enqvist, Sebastian, Leigh, Graham E

“…Abstract We introduce a path-based cyclic proof system for first-order $\mu $-calculus, the extension of first-order logic by second-order quantifiers for…”
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Eccentricity and algebraic connectivity of graphs by Afshari, B, Afshari, M

“…Let $G$ be a graph on $n$ nodes with algebraic connectivity $\lambda_{2}$. The eccentricity of a node is defined as the length of a longest shortest path…”
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Post's Programme for the Ershov Hierarchy by Afshari, Bahareh, Barmpalias, George, Cooper, S. Barry, Stephan, Frank

“…This article extends Post's; programme to finite levels of the Ershov hierarchy of Δ2 sets. Our initial characterization, in the spirit of Post (1994, Bulletin…”
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The Algebraic Connectivity of a Graph and its Complement by Afshari, B, Akbari, S, Moghaddamzadeh, M. J, Mohar, B

“…Linear Algebra Appl. (2018) For a graph $G$, let $\lambda_2(G)$ denote its second smallest Laplacian eigenvalue. It was conjectured that $\lambda_2(G) +…”
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Reliability qualification of a demountable packaging technology by Matta, F., Afshari, B., Pendse, R., Karnezos, M.

“…Demountable TAB (or DTAB) is a detachable, solderless, IC packaging technology based on using separable pressure contacts directly between the package and the…”
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Reliability of area array pressure contacts on the DTAB package by Karnezos, M., Pendse, R.D., Afshari, B., Matta, F., Scholz, K.D.

“…Pressure contacts using noble metals have been in use for a long time. The contact metallurgy, the design, and the reliability are well understood and proven…”
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Demountable TAB-a new path for TAB technology by Pendse, R.D., Afshari, B., Heflinger, B., Matta, F., Rastogi, V.

“…Despite its advantages, the proliferation of TAB technology in the high lead count single chip packaging world has been somewhat limited by factors such as…”
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An interim report on the comparisons of polymide to non-polyimide reliability for C4 by Phillips, J., Margaritis, G., Afshari, B.

“…Thermal cycling of non-underfilled C4 assemblies with polyimide shows that they are more reliable than C4 without polyimide. However, the reliability of…”
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Interim report on the comparisons of polyimide to non-polyimide reliability for C4 by Phillips, Jeff, Margaritis, George, Afshari, Bahram

“…Thermal cycling of non-underfilled C4 assemblies with polyimide shows that they are more reliable than C4 without polyimide. However, the reliability of…”
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New CBGA package with improved 2/sup nd/ level reliability by Pendse, R., Afshari, B., Butel, N., Leibovitz, J., Hosoi, Y., Shimada, M., Maeda, K., Maeda, M., Yonekura, H.

“…In the present work, we have studied several improvements in the materials, structure and design of the conventional flip chip-on-ceramic single chip package…”
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Demountable TAB: improving manufacturability of TAB by Afshari, B., Heflinger, B., Matta, F., Pendse, R.D.

“…Area array demountable tape automated bonding (DTAB), a novel demountable, high-performance TAB package, is discussed. Special features of this package, its…”
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Reliability of area array pressure contacts on the DTAB package by Karnezos, M., Pendse, R.D., Afshari, B., Matta, F., Scholz, K.

“…Demountable tape automated bonding (DTAB) is a VLSI package, developed and qualified for high performance (/spl Gt/100 MHz), high pincount (>400) ASICS with…”
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