Search Results - "Acker, Jörg"
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Studies on the deposition of copper in lithium-ion batteries during the deep discharge process
Published in Scientific reports (18-03-2021)“…End-of-life lithium-ion batteries represent an important secondary raw material source for nickel, cobalt, manganese and lithium compounds in order to obtain…”
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A phenomenological and quantitative view on the degradation of positive electrodes from spent lithium-ion batteries in humid atmosphere
Published in Scientific reports (06-04-2023)“…The present study deals with the phenomenological observation of the corrosion of the positive electrode foil of lithium-ion batteries containing LiNi 0.6 Co…”
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3
Silicon-28-Tetrafluoride as an Educt of Isotope-Engineered Silicon Compounds and Bulk Materials for Quantum Systems
Published in Molecules (Basel, Switzerland) (05-09-2024)“…This review provides a summary of the existing literature on a crucial raw material for the production of isotopically pure semiconductors, which are essential…”
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4
The Role of the Molecular Hydrogen Formation in the Process of Metal-Ion Reduction on Multicrystalline Silicon in a Hydrofluoric Acid Matrix
Published in Nanomaterials (Basel, Switzerland) (11-04-2021)“…Metal deposition on silicon in hydrofluoric acid (HF) solutions is a well-established process for the surface patterning of silicon. The reactions behind this…”
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Mass and Electron Balance for the Oxidation of Silicon during the Wet Chemical Etching in HF/HNO3 Mixtures
Published in Journal of physical chemistry. C (27-09-2012)“…The stoichiometry of the wet-chemical etching of silicon in concentrated HF/HNO3 mixtures has been studied. By quantifying the major reaction products in…”
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Etching Shapes the Topography of Silicon Wafers: Lattice-Strain Enhanced Chemical Reactivity of Silicon for Efficient Solar Cells
Published in ACS applied nano materials (24-08-2018)“…Multiwire sawing of silicon (Si) bricks is the state-of-the-art technology to produce multicrystalline Si solar wafers. The massive indentation of the abrasive…”
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The Kinetics and Stoichiometry of Metal Cation Reduction on Multi-Crystalline Silicon in a Dilute Hydrofluoric Acid Matrix
Published in Nanomaterials (Basel, Switzerland) (17-12-2020)“…In this study, the process of metal cation reduction on multi-crystalline silicon in a dilute hydrofluoric acid (HF) matrix is described using Ag(I), Cu(II),…”
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Recovery of Li(Ni 0.33 Mn 0.33 Co 0.33 )O₂ from Lithium-Ion Battery Cathodes: Aspects of Degradation
Published in Nanomaterials (Basel, Switzerland) (12-02-2019)“…Nickel⁻manganese⁻cobalt oxides, with LiNi Mn Co O₂ (NMC) as the most prominent compound, are state-of-the-art cathode materials for lithium-ion batteries in…”
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Reactive Species Generated during Wet Chemical Etching of Silicon in HF/HNO3 Mixtures
Published in The journal of physical chemistry. B (15-06-2006)“…The role of intermediate species generated during wet chemical etching of silicon in a HF-rich HF/HNO3 mixture was studied by spectroscopic and analytical…”
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Electroless-Deposited Platinum Antennas for Wireless Surface Acoustic Wave Sensors
Published in Materials (27-03-2019)“…In an effort to develop a cost-efficient technology for wireless high-temperature surface acoustic wave sensors, this study presents an evaluation of a…”
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NMR investigation of boron impurities in refined metallurgical grade silicon
Published in Physica status solidi. A, Applications and materials science (01-09-2015)“…The nuclear magnetic resonance (NMR) method was applied for tracking boron impurities in the refining process of metallurgical grade (MG) silicon. From the NMR…”
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12
Critical aspects on preparation of Bi-2223 glassy precursor by melt-process
Published in Journal of non-crystalline solids (01-02-2008)“…It is well known that many Bi–Sr–Ca–Cu–O compositions are glass forming and are converted into high-critical temperature superconductors after proper…”
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13
Chemical analysis of acidic silicon etch solutionsI. Titrimetric determination of HNO3, HF, and H2SiF6
Published in Talanta (Oxford) (15-09-2007)Get full text
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14
Sulfur incorporation in electroplated Cu(Ag) thin films
Published in Mikrochimica acta (1966) (01-11-2006)“…Cu(Ag) films are a promising interconnect material due to their low electrical resistivity and due to an expected increase of the electromigration resistance…”
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Glass–ceramic route of BSCCO superconductors – Fabrication of amorphous precursor
Published in Physica. C, Superconductivity (01-09-2007)“…It is well known that many Bi–Sr–Ca–Cu–O compositions are glass-forming and some Bi-based glasses such as Bi 2Sr 2CaCu 2O x and Bi 2Sr 2Ca 2Cu 3O x are…”
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Segregation of organic impurities in thin electroplated Cu metallizations
Published in Mikrochimica acta (1966) (01-11-2006)“…This article presents investigations regarding the incorporation of organic impurities in thin electroplated Cu metallizations. RF-GD-OES (radio frequency glow…”
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17
Raman spectroscopic determination of the degree of dissociation of nitric acid in binary and ternary mixtures with HF and H 2 SiF 6
Published in Journal of Raman spectroscopy (01-02-2020)“…Abstract The oxidizing effect of nitric acid in aqueous solutions depends on the concentration of undissociated nitric acid. This makes the concentration of…”
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Lattice strain enhanced acidic etching on as cut sawn silicon wafer
Published in Materials science in semiconductor processing (01-03-2021)“…The mechanical processing of silicon wafers leads to a heterogeneous lateral strain distribution and various modifications of the silicon, both of which…”
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Raman spectroscopic determination of the degree of dissociation of nitric acid in binary and ternary mixtures with HF and H2SiF6
Published in Journal of Raman spectroscopy (01-02-2020)“…The oxidizing effect of nitric acid in aqueous solutions depends on the concentration of undissociated nitric acid. This makes the concentration of…”
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Saw damage as an etch mask for the acidic texturization of multicrystalline silicon wafers
Published in Materials science in semiconductor processing (01-02-2018)“…The surface of multicrystalline silicon solar cells are etched by mixtures of HF, HNO3 and H2SiF6 in order to remove saw damage caused by wafer slicing, as…”
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