Search Results - "Abd‑Elrahman, Ashraf S."

The role of Sb on the microstructure and creep behaviors of Sn–6.5Zn–0.3Cu Pb-free solder alloy by Ragab, M., Alsnani, Hind, Hammad, A. E., Abd‑Elrahman, Ashraf S.

“…The objective of this research is to investigate the role of Sb addition on the microstructure and creep behaviors of the Sn–6.5Zn–0.3Cu solder alloy…”
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Impact of Sb additives on solidification performance, microstructure enhancement and tensile characteristics of Sn-6.5Zn-0.3Cu Pb-free solder alloy by Eid, E. A., El-Khawas, E. H., Abd-Elrahman, Ashraf S.

“…Solidification behavior, melting range, microstructure evolution plus tensile characteristics of Sn-6.5Zn–0.3Cu–(x = 0.0, 1.0, 3.0) wt% Sb alloys have been…”
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