Search Results - "ASMC proceedings"

Non-destructive acoustic metrology and void detection in 350 mu m TSV by Mair, R, Kotelyanskii, M, Mehendale, M, Ru, X, Mukundhan, P, Kryman, T, Liebens, M, Van Huylenbroeck, S, Haensel, L, Miller, A, Beyne, E, Murray, T

“…Through Silicon Via (TSV) technology represents one key aspect of 3D integration. International Technology Roadmap for Semiconductors (ITRS) has identified a…”
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Deep reinforcement learning for semiconductor production scheduling by Waschneck, Bernd, Reichstaller, Andre, Belzner, Lenz, Altenmuller, Thomas, Bauernhansl, Thomas, Knapp, Alexander, Kyek, Andreas

“…Despite producing tremendous success stories by identifying cat videos [1] or solving computer as well as board games [2], [3], the adoption of deep learning…”
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ScCO2 Drying for Preventing Pattern Collapse in Advanced Logic Device Structures by Sankarapandian, M., Lo, Wei-Shang, Ramirez, Alma Vela, Flores, Nash, Liu, Xuan, Yamanaka, Reijiro, Inoue, Saya, Shimomura, Shinichiro, Iwanaga, Koji

“…Supercritical CO 2 (ScCO 2 ) drying has been demonstrated to prevent pattern collapse causing Line Flop-over (LF) during post gate reactive ion etching (RIE)…”
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Optimization of O2 Plasma After Silicon Etch Process to Prevent Br-Induced Equipment Corrosion and Pattern Abnormality by Kang, Junseok, Yang, Ki Dong, Sinn, Soobin, Gim, Gyuwon, Park, Hanbit, Hwang, Wookyoung, Han, Eunyoung, Kim, Young Jeong, Kim, Joong Jung

“…Although hydrogen bromide (HBr) is an effective silicon etchant for patterning, it also generates SiBrx as a contaminant that causes equipment corrosion in the…”
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Controlling Discharge Condition of PE-SION Deposition Process for Finding a Balance Between NH3 Outgassing and Surface-Remained NH4+ions by Yang, Ki Dong, Suk, Keungjoo, Jeong, JaeIn, Hwang, Kwangtae, Lee, Joonho H., Kim, Young Jeong, Jung, Youngsoo, Kim, Young Eun, Kim, Joong Jung

“…In this work, the ability of reducing reaction byproduct from chemical vapor deposition of SiON thin film is explored changing balance gas, time and power…”
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Generative Adversarial Networks for Synthetic Defect Generation in Assembly and Test Manufacturing by Singh, Rajhans, Garg, Ravi, Patel, Nital S., Braun, Martin W.

“…Defect detection and classification is a critical step in any semiconductor manufacturing process. Most of the time it involves manual creation of defects…”
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A Deep Learning Model for Identification of Defect Patterns in Semiconductor Wafer Map by Yuan-Fu, Yang

“…The semiconductors are used as various precision components in many electronic products. Each layer must be inspected of defect after drawing and baking the…”
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Feedback Control in Station Dispatching to Improve Constraint Tool Output in 300mm Fabs by Krishna, Murali, Kalmus, Michael, Madson, Robert A, Mert, Arca, Mosgrove, David J, Trimeloni, Akanksha T, Merrill, Christopher J, Zhao, Zhili L

“…We present a novel feedback control system which influences wafer Lot prioritization over multiple non-constraint steps leading to a constraint toolset,…”
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Wafer Substrate Bevel Significance to Edge Yield Performance by Ma, Shuli, Ng, Belinda, Min Hou, Teo

“…In the realm of semiconductor technology, the pursuit of higher wafer yield has driven researchers to focus on optimizing wafer edge performance. This paper…”
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Optimization of Scatterometry Measurements by Enhancing with Machine Learning AM: Advanced Metrology by Srichandan, Sasmita, Heider, Franz, Ehrentraut, Georg, Lilje, Stephan, Putzi, Christian, Radosavljevic, Sanja, Sakalauskas, Egidijus

“…In this study, we introduce a machine learning approach designed to augment the conventional Rigorous Coupled-Wave Analysis (RCWA) method used in scatterometry…”
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Novel Chemical Development for Post Metal Etch Clean by Covolo-Whitesell, Lynn, Han, Yve, Patil, Sushil, Alamgir, Zahir, Freeman, Devin, Jira, Nicholas, Kiehl, Lukas, Lakshminarayanamurthy, Sanjna, Sundaramoorthy, Nirmal, Singh, Satish, Sih, Vincent, Shinomura, Hisashi, Kajiki, Yoshiyuku, Kamo, Satoshi, Kawahara, Koji, Tano, Hiroyuki

“…Advanced semiconductor manufacturing requires use of large amounts of environmentally toxic chemicals to process wafers. With advancement of technology node,…”
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Fault Detection of Wafer Sensors Based on Representation Learning and Isolation Forest by Qiu, Haixiang, Jiang, Hui

“…Wafer manufacturing is a complex process involving hundreds of process steps. Detecting and identifying potential anomalies and malfunctions in sensor…”
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Advanced Metrology of Thick Silicon Nitride Films at 300 mm Scale for Next Generation High-Q Photonic Devices by Kar, Soumen, Gangi, Nicholas W., Morgan, Katrina A., Carpenter, Lewis G., Fahrenkopf, Nicholas M., Baiocco, Christopher V.

“…The proposed paper will present various inline and offline advanced metrology data of thick SiN films (~>500 nm) prepared by plasma-enhanced chemical vapor…”
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Solution for Pond Shape Defect Near Wafer Edge by Koe, Mei Yen, Zhou, Juncheng, Xavier, Vinod

“…Defect reduction is one of the key factors to improve the process stability and yield in lithography process. This paper discusses defects in pond shape around…”
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Enabling 300 mm Wafer-Scale Fabrication of Superconducting Quantum Devices by Bhatia, Ekta, Frost, Hunter, Pieniazek, Nicholas, Nalaskowski, Jakub, Mucci, John, Collison, Wenli, Martinick, Brian, Telhu, Geevanie, Egan, Bryan, Olson, Stephen, Hung, Pui-Yee, Wells, Ilyssa, Johnson, Corbet, Murray, Thomas, Musick, Kevin, Rao, Satyavolu Papa

“…Superconducting quantum computing has demonstrated exponential improvements in coherence times over the past two decades, bringing us to the present Noisy…”
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Process and Tool Monitoring Strategy for Advanced Magnetic Tunnel Junction Stack Deposition by Rodriguez, Gabriel, Van Der Straten, Oscar, Mehta, Virat, Slaughter, J. M., Kaiser, Christian, Huang, Chien-Fu, Frye, Dan, Carr, Ryan

“…This paper will present the method by which a magnetron physical vapor deposition (PVD) tool is monitored and controlled for purposes of depositing a Magnetic…”
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Reliable Cu Pillar Undercut Control Using the Endpoint Detection System by Gardner, Zachary, Seo, Soon-Cheon, Khor, Pijeng, Waskiewicz, Chris, Sankarapandian, M., Perfecto, Eric, Pillai, Karthik, Demarest, James

“…This paper addresses the key challenges of copper (Cu) undercut control using the end point detection (EPD) system based on the Applied Materials Raider tool…”
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Semiconductor Manufacturing Data Synthesis through GANs by Tse, Brian, Wright, Tori, Nsiye, Emmanuel, Azinord, Timothy, Medina, David, Mondesire, Sean

“…This paper introduces a novel application of Generative Adversarial Networks (GANs) in the creation of a digital twin of a semiconductor manufacturing plant,…”
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Reduction of Stiction Using Different Surface Treatment Methods on Elastomers and Their Longevity Studies by Khosrawi, Maike, Dunn, Thomas, Brielmann, Renate, Durn, Feyzan, Gulcur, Murat

“…This study evaluated the effectiveness of Seal-Glide® surface treatments in reducing stiction of fluoroelastomer (FKM) and perfluoroelastomer (FFKM) O-rings to…”
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Study of Wafer Arcing Defects on PECVD Low Deposition Rate TEOS Oxide Thin Film by Wang, Minrui, Low, Irene, Lee, YB, Schmitt, Joseph

“…In this study, we have investigated wafer arcing defects on low deposition rate oxide thin film using tetraethyl-orthosilicate (TEOS) by Plasma Enhanced…”
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