Search Results - "ANDERSON OLVER, Kimberley"
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1
Flip Chip Bonding of 68 x 68 MWIR LED Arrays
Published in IEEE transactions on electronics packaging manufacturing (2009)Get full text
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2
Parameter Study of Resonator-Quantum Well Infrared Photodetectors
Published in IEEE journal of quantum electronics (01-10-2017)“…We recently proposed a resonator structure to increase the quantum efficiency (QE) of a quantum well infrared photodetector. In this paper, we performed a…”
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Journal Article -
3
Flip Chip Bonding of 68 [Formula Omitted] 68 MWIR LED Arrays
Published in IEEE transactions on electronics packaging manufacturing (01-01-2009)“…The flip chip bonding process is optimized by varying the bonding pressure, temperature, and time. The 68times68 mid wave infrared (MWIR) LED array was…”
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Journal Article -
4
Flip Chip Bonding of 68 \times 68 MWIR LED Arrays
Published in IEEE transactions on electronics packaging manufacturing (01-01-2009)“…The flip chip bonding process is optimized by varying the bonding pressure, temperature, and time. The 68times68 mid wave infrared (MWIR) LED array was…”
Get full text
Journal Article