Search Results - "AJIOKA, T"
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1
Water pH and temperature in Lake Biwa from MBT'/CBT indices during the last 280 000 years
Published in Climate of the past (17-10-2014)“…We generated a 280 000 yr record of water pH and temperature in Lake Biwa, central Japan, by analysing the methylation index (MBT′) and cyclisation ratio (CBT)…”
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2
An application of cathodoluminescence to optimize the shallow trench isolation process
Published in IEEE transactions on semiconductor manufacturing (01-11-2005)“…Cathodoluminescence (CL) spectroscopy was applied to optimize the shallow trench isolation (STI) process. The analysis of dislocations with CL spectroscopy…”
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3
Effects of surface hydrogen on the air oxidation at room temperature of HF-treated Si(100) surfaces
Published in Applied physics letters (29-01-1990)“…Thermally stimulated desorption and x-ray photoelectron spectroscopy were used to study the air oxidation at room temperature of HF-treated Si(100) surfaces…”
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4
Construction of a cost-effective failure analysis service network––microelectronic failure analysis service in Japan
Published in Microelectronics and reliability (01-04-2002)“…A failure analysis network has been constructed for providing cost-effective failure analysis service. In Japan, physical/chemical analysis service has been…”
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5
The effect of oxide charges at LOCOS isolation edges on oxide breakdown
Published in IEEE transactions on electron devices (01-10-1993)“…The degradation of time dependent dielectric breakdown (TDDB) characteristics at LOCOS isolation edges has been studied using MOS capacitors with and without…”
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6
The degradation of TDDB characteristics of Si0/sub 2//Si/sub 3/N/sub 4//Si0/sub 2/ stacked films caused by surface roughness of Si/sub 3/N/sub 4/ films (DRAMs)
Published in IEEE transactions on electron devices (01-12-1993)“…The effect of surface roughness of Si/sub 3/N/sub 4/ films on time-dependent dielectric breakdown (TDDB) characteristics of SiO/sub 2//Si/sub 3/N/sub…”
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7
Chemical analysis of metallic contamination on a wafer after wet cleaning
Published in IEEE transactions on semiconductor manufacturing (01-11-1994)“…The chemical analysis of trace metallic contamination on a wafer can be achieved by using total reflection X-ray fluorescence (TRXRF) with HF condensation and…”
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8
A method of eliminating B-mode dielectric breakdown failure in gate oxides utilizing a charging phenomenon
Published in IEEE transactions on electron devices (01-12-1993)“…An investigation of the dielectric breakdown characteristics of charged samples is discussed. B-mode dielectric breakdown failure was eliminated by scrubbing…”
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9
Prediction of dark currents in actual devices using new test structure
Published in ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures (1993)“…A test structure with four gate-controlled diodes (GCDs) and two junction diodes (with different dimensions) is designed in order to divide a dark current in…”
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Conference Proceeding -
10
The degradation of TDDB characteristics of SiO2/Si3N4/SiO2 stacked films caused by surface roughness of Si3N4 films
Published in IEEE transactions on electron devices (01-12-1993)Get full text
Journal Article -
11
Issues Of Wet Cleaning In ULSI Process
Published in International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM (1994)“…Wet cleaning for actual LSI processes is discussed. Particle elimination efficiency is limited by suppression of device degradation and cleaning is invalid for…”
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Conference Proceeding -
12
Electron trap center generation due to hole trapping in SiO sub(2) under Flowler-Nordheim tunneling stress
Published in Applied physics letters (01-01-1987)“…The relation between generation of neutral electron trapping in thermally grown SiO sub(2) under Fowler-Nordheim tunneling stress has been investigated. The…”
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Journal Article -
13
Characterization of the implantation damage in SiO sub(2) with x-ray photoelectron spectroscopy
Published in Applied physics letters (01-01-1986)“…X-ray photoelectron spectroscopy (XPS) has been applied to characterize the damage introduced into SiO sub(2) by ion implantation. By measuring the peak width…”
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14
The degradation of TDDB characteristics of SiO(2)/Si(3)N(4)/SiO(2) stacked films caused by surfaceroughness of Si(3)N(4) films DRAMs
Published in IEEE transactions on electron devices (01-12-1993)“…The effect of surface roughness of Si(3)N(4) films on time-dependent dielectric breakdown (TDDB) characteristics of SiO(2)/Si(3)N(4)/SiO(2) (ONO) stacked films…”
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Journal Article -
15
Electron trap center generation due to hole trapping in SiO2 under Fowler-Nordheim tunneling stress
Published in Applied physics letters (10-08-1987)“…The relation between generation of neutral electron trap centers and hole trapping in thermally grown SiO2 under Fowler–Nordheim tunneling stress has been…”
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16
Characterization of the implantation damage in SiO2 with x-ray photoelectron spectroscopy
Published in Applied physics letters (19-05-1986)“…X-ray photoelectron spectroscopy (XPS) has been applied to characterize the damage introduced into SiO2 by ion implantation. By measuring the peak width of…”
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Journal Article -
17
Critical current densities and magnetic hysteresis losses in submicron filament bronze-processed Nb/sub 3/Sn wires
Published in IEEE transactions on magnetics (01-03-1991)“…Submicron-filament bronze-processed multifilamentary Nb/sub 3/Sn wires with a Cu-5at.%Sn matrix and Nb or Nb alloy cores have been fabricated. The Nb alloy…”
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18
Critical current densities and magnetic hysteresis losses in submicron filament bronze-processed Nb(3)Sn wires
Published in IEEE transactions on magnetics (01-03-1991)“…Submicron-filament bronze-processed multifilamentary Nb(3)Sn wires with a Cu-5at.%Sn matrix and Nb or Nb alloy cores have been fabricated. The Nb alloy cores…”
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Journal Article -
19
Critical current densities and magnetic hysteresis losses in submicron filament bronze-processed Sb,Sn wires
Published in IEEE Transactions on Magnetics (Institute of Electrical and Electronics Engineers); (United States) (01-03-1991)“…This paper reports on submicron filament bronze-processed multifilamentary Nb{sub 3}Sn wires with Cu-5at%Sn matrix and Nb or Nb alloy cores. The Nb alloy cores…”
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Conference Proceeding -
20
Critical current densities and magnetic hysteresis loses in submicron filament bronze-processed Nb3Sn wires
Published in IEEE transactions on magnetics (1991)Get full text
Conference Proceeding