Search Results - "AGIA, M"

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  1. 1
    Accelerated thermal fatigue of lead-free solder joints as a function of reflow cooling rate

    Accelerated thermal fatigue of lead-free solder joints as a function of reflow cooling rate by QI, Y, ZBRZEZNY, A. R, AGIA, M, LAM, R, GHORBANI, H. R, SNUGOVSKY, P, PEROVIC, D. D, SPELT, J. K

    Published in Journal of electronic materials (01-12-2004)
    “…Leadless chip resistor (LCR) assemblies were manufactured using both traditional tin-lead (Sn37Pb) and lead-free (Sn3.8Ag0.7Cu) solders. The leadfree test…”
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    Conference Proceeding Journal Article
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    Interpreting the Procyclical Productivity of Manufacturing Sectors: External Effects or Labor Hoarding?

    Interpreting the Procyclical Productivity of Manufacturing Sectors: External Effects or Labor Hoarding? by Sbordone, Argia M.

    Published in Journal of money, credit and banking (01-02-1997)
    “…This paper investigates whether procyclical productivity is due to cyclical variations in the rate of utilization of labor or to technological externalities…”
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    Journal Article
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