Search Results - "8th Reliability Physics Symposium"

Emitter Avalanche Stress on Gated Transistors by Bosselaar, C.A.

“…Emitter avalanche stress is of growing importance for the study of dielectric coatings on semiconductors and for the investigation of the reliability of…”
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Catastrophic Damage in "Close-Confined" AlGaAs-GaAs Heterojunction Injection Lasers by Kressel, H., Sommers, H. S., Lockwood, H. F., Ettenberg, M., Nelson, H.

“…The peak optical power at which catastrophic damage occurs in heterojunction lasers has been investigated. The allowable peak power is shown to decrease…”
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Resistance Changes on Absorption and Desorption of Hydrogen from Evanohm Resistors by Marks, Burton S., Stewart, Robert G.

“…Hydrogen gas, the foaming agent in RTV-5370 silicone foam encapsulating plastic, caused resistance increases in thin film Evanohm resistors. The hydrogen is a…”
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Equivalent Circuits Describing the Planar Devices Behavior Under Ionizing Radiations by Martinot, H., Esteve, D., Rey, G.

“…The main features of the behavior of bipolar and MOS transistors under ionizing radiations are first briefly reminded and the physical origin of degradation is…”
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Use a SEM on a Production Line? by Adolphsen, John W., Anstead, Robert J.

“…The use of the scanning electron microscope (SEM) as an in-line, quality control tool to selectively sample-screen semiconductor devices for metallization…”
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A Systems Oriented Components Selection Optimization Technique by Hollingshead, Charles O.

“…A technique is introduced which optimizes the selection of parts for system application by reliability/quality levels through systematizing the compilation and…”
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Use of Test Patterns in Evaluating the Reliability of Integrated Circuits by Sahni, Ravinder J.

“…The reliability of a large scale integrated circuit chip is an aggregate of the reliability of each of its constituents. Therefore, the total failure rate is…”
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Reliability Studies of LSI Arrays Employing Al-Si Schottky Barrier Devices by Jenkins, R. T., Fitzgerald, D. J.

“…Recently digital bipolar LSI arrays employing Al-Si Schottky barrier devices have become commercially available. The introduction of a novel semiconductor…”
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Interface Films in the Si-Al System by Lawrence, J. E., Khidr, M. S.

“…Carbon-like interface films exert both a metallurigical and electrical effect on Semiconductor products. Test devices without contamination have uniform…”
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Ambient Effects on Gold-Aluninum Bonds by Rossiter, Thomas J.

“…It has been observed that gold-aluminum bond degradation is dependent upon the ambient gas that exists in an integrated circuit package. Hermetic samples,…”
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Current Crowding Effects at Aluminun-Silicon Contacts by Prokop, G. S., Ting, C. Y., Joseph, R. R.

“…The magnitude of current crowding and its effects on failure mechanisms at aluminum-silicon contacts have been studied by using an enlarged contact. Current…”
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Purple Plague Revisited by Philofsky, Elliott

“…Intermetallic formation in gold-aluminum systems has been studied at 200°C to 460°C using butt-welded diffusion couples. The predominant intermetallic phase…”
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Degradation of GaAs and Ga1-xAlxAs Light Emitting Diodes by Blum, J. M., Konnerth, K. L., Marinace, J. C., Woodall, J.

“…Life test data on the degradation characteristics of GaAs and GaAlAs light emitting diodes are presented. The GaAs data show the effects of diode processing…”
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Power Handling Capability and Temperature Distribution for Different Transistor Structures by Arlt, Manfred, Grasser, Leo, Guckel, Helmut, Rucker, Dieter

“…To achieve good high-power performance, power transistors are often constructed having a fine interdigitated structure. These transistors are very susceptible…”
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Room Temperature Instabilities Observed on Silicon Gate Devices by Faggin, F., Forsythe, D. D., Klein, T.

“…A room temperature ionic instability has been observed on p-channel silicon gate MOS devices processed in a specific manner. This instability appears as a…”
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Can Plastic Encapsuiated Microcircuits Provide Reliability with Economy? by Brauer, Joseph B., Kapfer, Vincent C., Tamburrino, Alfred L.

“…Associated with plastic encapsulation for micro-circuits is a set of failure mechanisms which may make these devices unsuitable for high reliability use…”
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Accelerated Humidity Tests for Plastic Encapsulated Devices by Bair, Byron L., Herr, Erwin A.

“…This late news paper presents the results of the examination of the screening effectiveness of steam pressure and boiling water stresses for rapidly evaluating…”
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Theory of the Failure of Semiconductor Contacts by Electromigration by Oliver, C. B., Bower, D. B.

“…A theory is presented which predicts the time required for a metal film conductor on a silicon substrate to fail as a result of electromigration. The failure…”
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Gold-Aluminum Bond Failure Mechanism by Haefling, J. F., Meyer, D. E.

“…The degradation of Au/Al contacts on semiconductor devices as a function of process parameters and environment has been studied. Test samples were bonded under…”
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Degradation of GaAs-P Light Emitting Diodes by Grenning, D., Lamb, R., Duffy, P.

“…The expectation of large volume usage of solid-state lamps, using the GaAs-P system, has generated tremendous effort in this infant field. Data on factors…”
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