Search Results - "2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific)"

The Comparison of the Reliability Performance of Different Top Metal Materials in MEMS Applications by Hein, Verena, Weide-Zaage, Kirsten, Clausner, Andre

“…The combination of analog/mixed-signal, high-voltage and embedded non-volatile memory options with sensor and actuator integration is still common in…”
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Recent Developments and Challenges in Battery Safety with Solid-State Technology by Freitas, Sierra, Li, Weiyang

“…In recent years, there has been a noteworthy shift from conventional lithium-ion batteries using liquid electrolytes to solid-state batteries. Solid-state…”
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The Data Revolution Within Electronics Manufacturing: Digitization + AI/ML by Gamble, Ryan, Gutierrez, Daniel

“…Data collection and analytics are critical to navigating today's supply chain challenges and market demands. The increasing complexity of electronic products…”
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Artificial Intelligence-Based Methods for Assessment of Accrued Damage and Remaining Use-Life in Automotive Underhood Electronics by Lall, Pradeep, Thomas, Tony, Mehta, Vishal

“…To ensure the smooth and uninterrupted operation of electronic systems over their lifespan, it is essential to assess progressive damage accrual and remaining…”
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Development and Characterization of Sn99Ag0.3Cu0.7 -(ZrO2/CuO/TiO2) Nano-Composite Solder Alloys by Illes, Balazs, Choi, Halim, Illes, Balazs, Skwarek, Agata

“…The "lead-free" change in the soldering technology caused the widespread application of the SnAgCu (SAC) solder alloys. The so-called low Ag content ones, like…”
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Reliable and Automated Connection of Printed Electronics to the Aviation Electrical System by Frohlich, Jan, Piechulek, Niklas, Nguyen, Huong Giang, Franke, Jorg, Jurgenhake, Christoph

“…In recent years, numerous applications for printed electronics have been successfully implemented. Heating elements, sophisticated circuits, sensors, and…”
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The Challenge of Lower Temperature Soldering for Large Ball-Grid Array Board-Level Assembly Process by Zhang, Hongwen, Richmond, Tyler, Wang, Huaguang, Mutuku, Francis

“…Lower temperature soldering has been considered as one of the effective ways to reduce the risk of warpage on PCB assembly. Use of lower-temperature solders,…”
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Swelling in Lithium-Ion Pouch Batteries by Osterman, Michael, Maddipatla, Sahithi

“…Lithium-ion batteries are widely used in various applications, such as electric vehicles, portable devices, and gid-scale energy storage. One of the major…”
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Elevating Excellence in High-Reliability Electronics: The Personal and Lasting Legacy of Clean PCBs by Worden, Justin Cody

“…In the realm of printed circuit board (PCB) production, the adage "Business is personal, and our legacy lives through the products we produce" resonates…”
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Advanced Analysis and Monitoring of Failure Mechanisms in Microelectronics Metallization by Clausner, Andre, Kraatz, Matthias, Crocoll, Sonja, Schuchart, Marc, Hein, Verena

“…Metallization structures in microelectronic systems undergo various degradation processes. They can be caused by diffusion mechanisms induced by electrical…”
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Evaluation of Surface Mount Technology Reliability of Aerosol-Jet Printed Structures as Landing Pads for Surface Mounted Devices by Quinn, Eddie, Singer, Jesse, Weidman, Laura Jean, Irizarry, Angel, Lee, Marcus

“…This paper aims to present the extensive reliability testing results of printed electronics acting as landing pads for traditional Surface Mount Devices (SMD)…”
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Dna Digital-storage: Advantages, Approach and Technical Implementation by Weide-Zaage, Kirsten

“…The data generated in science, technology and general life is increasing every year. A data volume of over 126 zetabytes of digital data is already being…”
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New Solutions To Combat Counterfeits by Hook, Adam

“…Prolonged lead times with tier 1 component suppliers during COVID had many OEMs stuck with 100,000 1 vehicles and electronic systems unable to ship because…”
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It Ain't Gonna Happen: Interplanetary Colonization by Mullen, Hailey, Lasky, Ronald

“…This paper presents a systematic review of the daunting challenges that cast doubt on the feasibility of interplanetary colonization, with a focus on Mars…”
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An Improved Automated SPI Data Analysis Report Generator for Printed Circuit Board Assembly by Alshraida, Hamzeh, Santos, Daryl, Lee, Joseph, Dabous, Iman, Aguilar, Talbert, Hubble, Neil

“…The growing need for dependable assembly procedures in electronic manufacturing, driven by the trend toward miniaturization, necessitates effective measures to…”
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Realization of Sustainable Additively Printed Circuits using Aerosol-Jet Inkjet and Direct-Write Processes by Lall, Pradeep, Soni, Ved, Narangaparambil, Jinesh, Kulkarni, Shriram, Miller, Scott

“…Water-based inks have been developed to achieve conductive circuits using additive processes, due to the increasing importance of environmental, social, and…”
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Implementation of the Product Reliability Program by Cooper, John

“…The product reliability program was initiated to verify that the product being rushed into production is ready. That it has been through a process of analysis,…”
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The Status of Low Temperature Solders by Lasky, Ron, Tevis, Ian, Lasky, Ron

“…For more than a decade, tens to hundreds of millions of dollars have been invested in research on tin-bismuth based, low temperature lead-free solders. At…”
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Industry 4.0 Technology Adoption Issues for Small- and Medium-Sized Manufacturers and the Role of AI to Improve Adoption Rates by Harris, Gregory A., Yarbrough, Ashley

“…Original Equipment Manufacturers and large first-tier manufacturing companies have realized the need to utilize digitalization to compete in the global…”
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Adiabatic & Isothermal Humidification for Electronics Manufacturing: The Science of Humidity Control in Manufacturing by Williams, Richard

“…Humidification is a key component of an effective ESD program and a process control system (a set of procedures designed to ensure that processes within a…”
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