Search Results - "2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)"
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Understanding and Predicting the Activation Energy of Oxygen Migration in Pr0.5Ca0.5MnO₃: A DFT study
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…\mathrm{Pr}_{1-x}\mathrm{Ca}_{x}\mathrm{MnO}_{3}(\mathrm{PCMO}(x)) is a popularly explored material for the resistive random access memory (RRAM) application…”
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Recorded Ferroelectric Polarization Switching of Hf0.5Zr0.5O₂ Capacitors Achieved by Thermal Rewake-up
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…Hf 0.5 Zr 0.5 O 2 (HZO) capacitors are well prepared with excellent ferroelectricity, and recorded polarization switching…”
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Dual-k Reconfigurable Silicon Nanowire Schottky Barrier Transistor for Biosensing
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…In this study, Dual-k Reconfigurable Silicon Nanowire Schottky Barrier Transistor (Dk R SiNW SBT) is investigated and discussed for biosensing applications. We…”
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Monolayer HfS₃: A Potential Candidate for Low-Power and High-Performance Field-Effect Transistors
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…The two-dimensional (2-D) materials hold promise for the ultra-scaled future logic devices. Major semiconductor companies are actively dedicating substantial…”
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5
Perspective Roadmap of Advanced HfO2-based Ferroelectric Field Effect Transistors
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…The discovery of ferroelectricity in hafnium oxide (HfO 2 ) has proved to be a game changer in the potential applications of ferroelectric non-volatile…”
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Impact of Doping CsPbBr3 with Organic Iodide Salts on Memory Performance
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…This template has been tailored for output on A4- or letter-sized paper. The intriguing memory effect in CsPbBr 3 perovskite is of interest in materials…”
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Ferroelectric Gate Stack Engineering with Tunnel Dielectric Insert for Achieving High MemoryWindow in FEFETs for NAND Applications
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…We experimentally demonstrate a novel gate stack engineering technique by introducing a Tunnel Dielectric Layer (TDL) between two Ferroelectric (FE) layers,…”
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A comparative study of two-step and three-step annealing processes for PVDF added FASnI3 film quality and solar cell
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…Among the non-toxic perovskites, tin-halide perovskite solar cell (PSC) is the most attractive for commercial application. However, their efficiencies and…”
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Influence of ALD pulse times and deposition temperature on electrical properties and reliability of MIM decoupling capacitors based on Al-doped ZrO2 high-κ dielectric in BEoL conditions
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…This paper explores the impact of important ALD parameters, especially of precursor/reactant pulse times as well as of deposition temperature and the…”
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10
Erase Efficiency Improvement of Ferroelectric FET with IGZO Channel by P-Type SnOx Layer
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…We have investigated the influence of the p-type oxide semiconductor (OS) insertion layer on the memory characteristics of InGaZnO x (IGZO)-channel…”
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11
High-k dielectric integration to improve breakdown characteristics of β-Ga₂O₃ Schottky diode
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…In this work, we have utilized a high-k dielectric material, bismuth zinc niobium oxide (BZN), to fabricate metal-insulator-semiconductor (MIS) heterostructure…”
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Indigenous back-end-of-line compatible SiO2-based One-Time Programmable Memory for Secured Spiking Neural Network Inference Accelerator
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…The low-power, biology-inspired spiking neural networks (SNN) based architectures have facilitated artificial intelligence applications for edge applications…”
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13
Ultrasensitive Photo-Thermal Multimodal Sensory based on Self-Doping Modulation of Bi2O2Se Semiconductor
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…Herein, high-performance photo-thermal multimodal sensors based on novel two-dimentional layered Bi 2 O 2 Se semiconductor were demonstrated, wherein the…”
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Ohmic Au-MoS2 Contacts Enabled by Re Adsorbed MoS2 Source/Drain Regions: An Ab-initio Quantum Transport Study
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…This study delves into the improved transport properties of 2D MoS 2 devices with metal contacts achieved through substitutional doping or adsorbed metals. We…”
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15
Study of Trap Generation in NAND Flash Tunnel Oxide using TCAD
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…The Physical TCAD models, which have been validated for the aging of logic devices, are utilized to simulate trap generation (TG) in a memory device during…”
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Ultra-High Endurance (>1012) and High Drive-Current Selector in Sub-30nmΦ Cell using Stable Oxide Doped with As-Se Free High Melting-Point Compound
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…We demonstrate ultra-high endurance selector with excellent scalability toward high-performance cross-point storage class memory (SCM). By employing stable…”
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17
Reduction of contact resistance to PVD-MoS₂ film using aluminum-scandium alloy (AISc) edge contact
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…The contact resistance was reduced by aluminum-scandium alloy (AlSc) edge contact for the MoS 2 film deposited by sputtering. Moreover, after annealing in a…”
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18
High-Speed Electrical Transient Thermometry of Monolayer MoS2
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…Self-heating greatly limits performance of devices based on two-dimensional (2D) materials. Here, we present a novel high-speed thermometry method for 2D…”
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NiO/Ni2O3 based top gated junctionless field effect device for selective Cr(VI) ion detection in water
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…We demonstrated NiO/Ni 2 O 3 (semiconductor/dielectric) top gated field effect device for Cr(VI) detection. The device showed excellent sensing with a maximum…”
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20
Comparative Analysis of Switching Efficiency of GeTe and VO2 based RF Switches
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03-03-2024)“…Phase change materials (PCMs) are extensively employed in switchable, reconfigurable, and tunable devices operating from DC to optical frequencies because of…”
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