Search Results - "2019 IEEE International Reliability Physics Symposium (IRPS)"

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  1. 1

    Comprehensive Study for OFF-State Hot Carrier Degrdation of Scaled nMOSFETs in DRAM by Lee, Nam-Hyun, Kim, Jongkyun, Son, Donghee, Kim, Kangjun, Seok, Jung Eun

    “…In this paper, comprehensive study for OFF-state hot carrier degradation of scaled nMOSFETs in DRAM was examined using devices with different effective channel…”
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    Conference Proceeding
  2. 2

    Perimeter Driven Transport in the p-GaN Gate as a Limiting Factor for Gate Reliability by Stoffels, S., Posthuma, N., Decoutere, S., Bakeroot, B., Tallarico, A.N., Sangiorgi, Enrico, Fiegna, Claudio, Zheng, J., Ma, X., Borga, M., Fabris, Elena, Meneghini, M., Zanoni, E., Meneghesso, G., Priesol, J., Satka, A.

    “…In this paper, we present an in-depth study of the gate leakage mechanisms and correlated breakdown of GaN-based power HEMTs with p-GaN gate, controlled by a…”
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    Conference Proceeding
  3. 3

    UV-Assisted Probing of Deep-Level Interface Traps in GaN MISHEMTs and Their Role in Threshold Voltage & Gate Leakage Instabilities by Dutta Gupta, Sayak, Joshi, Vipin, Shankar, Bhawani, Shikha, Swati, Raghavan, Srinivasan, Shrivastava, Mayank

    “…This work demonstrates UV assisted probing of deep level traps in dielectric/GaN interface. The deep level donor traps lead to threshold voltage and gate…”
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    Conference Proceeding
  4. 4

    Tolerance of Deep Neural Network Against the Bit Error Rate of NAND Flash Memory by Hasan, Mehedi, Ray, Biswajit

    “…Flash memory can store large number of model weights for a deep neural network on edge devices. In this paper, we study the effects of Flash's bit-error-rate…”
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    Conference Proceeding
  5. 5

    Process-induced anomalous current transport in graphene/InAlN/GaN heterostructured diodes by Satterthwaite, Peter F., Yalamarthy, Ananth Saran, Vaziri, Sam, Rojo, Miguel Munoz, Pop, Eric, Senesky, Debbie G.

    “…Graphene and III-nitride semiconductors are promising materials platforms for the development of high-frequency, high-power electronic devices. Successful…”
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    Conference Proceeding
  6. 6

    Bias Temperature Instability Reliability in Stacked Gate-All-Around Nanosheet Transistor by Wang, Miaomiao, Zhang, Jingyun, Zhou, Huimei, Southwick, Richard G., Kuo Chao, Robin Hsin, Miao, Xin, Basker, Veeraraghavan S., Yamashita, Tenko, Guo, Dechao, Karve, Gauri, Bu, Huiming, Stathis, James H.

    “…In this paper, we report the bias temperature instability (BTI) reliability in stacked gate-all-around (GAA) nanosheet (NS) devices. We show that, in addition…”
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    Conference Proceeding
  7. 7

    Permanent and Transient Effects of High-Temperature Bias Stress on Room- Temperature V Drift Measurements in SiC Power MOSFETs by Habersat, Daniel B., Green, Ronald, Lelis, Aivars J.

    “…Differences in the bias-temperature-stress response of SiC MOSFETs result from the complex interaction of the charge trapping mechanisms responsible for…”
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    Conference Proceeding
  8. 8

    mu s-Range Evaluation of Threshold Voltage Instabilities of GaN-on-Si HEMTs with p-GaN Gate by Canato, E., Masin, F., Borga, M., Zanoni, E., Meneghini, M., Meneghesso, G., Stockman, A., Banerjee, A., Moens, P.

    “…We propose a technique to evaluate the time-dependence of the threshold voltage instabilities in GaN-based normally-off transistors under positive gate bias…”
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    Conference Proceeding
  9. 9

    Gate-Stack Engineered NBTI Improvements in Highvoltage Logic-For-Memory High-ĸ/Metal Gate Devices by O'Sullivan, B.J., Ritzenthaler, R., Rzepa, G., Wu, Z., Litta, E. Dentoni, Richard, O., Conard, T., Machkaoutsan, V., Fazan, P., Kim, C., Franco, J., Kaczer, B., Grasser, T., Spessot, A., Linten, D, Horiguchi, N.

    “…Potential solutions for the reliability challenges of high- k metal gate (HKMG) integration into DRAM high-voltage peripheral logic devices are reported. A…”
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    Conference Proceeding
  10. 10

    Array-Based Statistical Characterization of CMOS Degradation Modes and Modeling of the Time-Dependent Variability Induced by Different Stress Patterns in the \}, \boldsymbol}\} bias space by Bury, E., Chasin, A., Vandemaele, M., Van Beek, S., Franco, J., Kaczer, B., Linten, D.

    “…Degradation mechanisms, such as Bias Temperature Instabilities (BTI) and Hot Carrier Degradation (HCD), as well as the associated time-dependent variability,…”
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    Conference Proceeding
  11. 11

    Full ( V},\ V}) Bias Space Modeling of Hot-Carrier Degradation in Nanowire FETs by Vandemaele, Michiel, Kaczer, Ben, Tyaginov, Stanislav, Stanojevic, Zlatan, Makarov, Alexander, Chasin, Adrian, Bury, Erik, Mertens, Hans, Linten, Dimitri, Groeseneken, Guido

    “…Simulations of hot-carrier degradation of nanowire field-effect transistors are reported. The simulations rely on the carrier energy distribution function,…”
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    Conference Proceeding
  12. 12
  13. 13

    Characterization and Analysis of Bit Errors in 3D TLC NAND Flash Memory by Papandreou, Nikolaos, Pozidis, Haralampos, Parnell, Thomas, Ioannou, Nikolas, Pletka, Roman, Tomic, Sasa, Breen, Patrick, Tressler, Gary, Fry, Aaron, Fisher, Timothy

    “…3D NAND flash memory has entered dynamically into the space of enterprise server and storage systems, offering significantly higher capacity and better…”
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    Conference Proceeding
  14. 14

    VTH-Hysteresis and Interface States Characterisation in SiC Power MOSFETs with Planar and Trench Gate by Asllani, Besar, Castellazzi, Alberto, Salvado, Oriol Avino, Fayyaz, Asad, Morel, Herve, Planson, Dominique

    “…This paper contributes to investigations on the threshold-voltage (V_{TH}) hysteresis in SiC power MOSFETs. Such effect is of relevance mainly for…”
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    Conference Proceeding
  15. 15

    New Insights into the Imprint Effect in FE-HfO2 and its Recovery by Higashi, Y., Florent, K., Subirats, A., Kaczer, B., Di Piazza, L., Clima, S., Ronchi, N., McMitchell, S. R. C., Banerjee, K., Celano, U., Suzuki, M., Linten, D., Van Houdt, J.

    “…The mechanism of imprint in FE-HfO 2 is investigated in detail. It is clearly shown that the imprint can be recovered by additional pulses and domain switching…”
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    Conference Proceeding
  16. 16

    A Physical-Statistical Approach to AlGaN/GaN HEMT Reliability by Moens, Peter, Stockman, Arno

    “…This paper proposes a physical-statistical approach to AIGaN/GaN HEMT reliability applied to forward gate bias stress. The Ig- V g characteristics are fitted…”
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    Conference Proceeding
  17. 17

    Time Dependent Dielectric Breakdown of Cobalt and Ruthenium Interconnects at 36nm Pitch by Huang, H., McLaughin, P. S., Kelly, J. J., Yang, C. -C., Southwick, R. G., Wang, M., Bonilla, G., Karve, G.

    “…Time dependent dielectric breakdown (TDDB) properties of cobalt and ruthenium interconnects were investigated in 36 nm pitch dual damascene test vehicles. We…”
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    Conference Proceeding
  18. 18

    Reliability of 8Mbit Embedded-STT-MRAM in 28nm FDSOI Technology by Ji, Y., Goo, H. J., Lim, J., Lee, S. B., Lee, S., Uemura, T., Park, J. C., Han, S. I., Shin, S. C., Lee, J. H., Song, Y. J., Lee, K. M., Shin, H. M., Hwang, S. H., Seo, B. Y., Lee, Y. K., Kim, J. C., Koh, G. H., Park, K. C., Pae, S., Jeong, G. T., Yoon, J. S., Jung, E. S.

    “…STT-MRAM has great attention as next generation memory to replace commercialized memory. However, not many articles are available on various MRAM reliability…”
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    Conference Proceeding
  19. 19

    A New Approach to Validate GaN FET Reliability to Power-Line Surges Under Use-Conditions by Bahl, Sandeep R., Brohlin, Paul

    “…The robustness of FETs to power-line surges has a tremendous impact on field reliability and is an important consideration for the adoption of new technologies…”
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    Conference Proceeding
  20. 20

    Surrogate Model Assisted Design of Silicon Anode Considering Lithiation Induced Stresses by Zheng, Zhuoyuan, Chen, Bo, Gurumukhi, Yashraj, Cook, John, Ates, Mehmet N., Miljkovic, Nenad, Braun, Paul V., Wang, Pingfeng

    “…Silicon-based lithium ion battery anodes are attracting considerable attention due to their high theoretical capacity. However, the significant volume change…”
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    Conference Proceeding