Search Results - "2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)"

Modelling and characterization on wafer to wafer hybrid bonding technology for 3D IC packaging by Ji, L., Che, F.X., Ji, H.M., Li, H.Y., Kawano, M.

“…For Wafer to Wafer Hybrid Bonding (W2W-HB) technology, warpage mitigation and precise Cu to Cu bonding are required to ensure a robust bonding integrity. This…”
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Numerical Investigation on Heat Transfer Enhancement with Perforated Square Micro-Pin Fin Heat Sink for Electronic Cooling Application by Gupta, Deepa, Saha, Probir, Roy, Somnath

“…In this paper, heat transfer enhancement through perforated square micro-pin fins (edge = 180 microns) has been analyzed through numerical simulation. A…”
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Thermal simulation and measurement of SiC MOSETs by Kim, Jung Kyun

“…This paper shows that thermal characterization of SiC MOSFETs module using the thermal transient measurement method, simulation, and calibration. To determine…”
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Design and Experiment of Shielding Package for Electronic Devices in Pulsed Strong Magnetic Field by Yuxin, Yang, Keren, Dai, He, Zhang, Peng, Liu, Qiang, Yin

“…Electromagnetic railgun is a new concept weapon that uses electromagnetic force to launch projectiles. However, it differs from conventional guns in that the…”
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Design, Fabrication and Characterization of Surface Electrode Ion Trap Integrated with TSV by Zhao, Peng, Tao, Jing, Li, Hong Yu, Lim, Yu Dian, Guidoni, Luca, Tan, Chuan Seng

“…Further miniaturization of surface electrode ion trap is restricted by wire bonding connection. To resolve this restriction, integration of conventional…”
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Magnetic Inductor Integration in FO-WLP using RDL-first Approach by Boon, Soh Siew, Wee, David Ho Soon, Salahuddin, Raju, Singh, Ravinder Pal

“…FO-WLP with integrated solenoidal magnetic core inductor in the RDL layer was proposed and developed in this work. This provide a packaging solution to…”
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Analysis of Flip-Chip Solder Joints under Isothermal Vibration Loading by Meier, K., Leslie, D., Dasgupta, A., Roellig, M., Bock, K.

“…This work focuses on the reliability needs which are caused by the use of recent package solutions for harsh environmental use cases such as assisted or…”
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High Aspect Ratio (>10:1) Via-Middle TSV with High-k Dielectric Liner Oxide by Chui, K., Wang, I-Ting, Che, Faxing, Ji, Lin, Yao, Zhu

“…Downward scaling of TSV feature-size provides benefits in terms of increased interconnection density, which translates to increased data bandwidth between…”
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High Power Large Size HFCBGA Thermal Characterization by Hu, Ian, Tsai, Jung-Che, Cheng, Frank, Yen, Shiu-Fang, Shih, Meng-Kai, Tarng, David, Pai, Benjamin, Hung, CP

“…Nowadays, the integrated infrastructure for big data and intelligence analytics is more and more important; which drives the requirement of high power large…”
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Fabrication of Deep Microfeatures in Glass Substrate using Electrochemical Discharge Machining for Biomedical and Microfluidic Applications by Mishra, Dileep Kumar, Arab, Julfekar, Pawar, Karan, Dixit, Pradeep

“…Microchannels created in glass-based substrates have wide application in biomedical and microfluidics devices. Electrochemical discharge machining (ECDM) is a…”
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Parameter identification of Anand constitutive models for SAC305 using the intelligent optimization algorithm by Zhang, Zhao, Chen, Zhiwen, Liu, Sheng, Dong, Fang

“…Through finite element simulation to obtain the reliability of electronic products is an effective way to reduce experiment cost and shorten the development…”
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Creep Damage of BGA Solder Interconnects Subjected to Thermal Cycling and Isothermal Ageing by Depiver, Joshua A., Mallik, Sabuj, Harmanto, Dani, Amalu, Emeka H.

“…Solder joints of electronic components are the most critical part of any electronic device. Their untimely failure during the system's operation often…”
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Development of a Glass Technology Based 79 GHz MIMO Radar Front-End Module for Autonomous Driving by Tschoban, Christian, Rossi, Marco, Reyes, Jacob, Ndip, Ivan, Lang, Klaus-Dieter

“…In this paper, a holistic approach, the M3-approach (Methodologies, Models, Measures), is applied for the efficient and accurate design of a 79 GHz scalable…”
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Study on the Method to Analyze the Electrical Contact Resistances of Press-Pack IGBT devices by Wang, Xiao, Li, Hui, Yao, Ran, Long, Haiyang, Zhong, Yi, Yu, Renze, Li, Jinyuan

“…Electrical contact resistances are the link between the mechanical model and the electrical model, which should be accurately determined to analyze the…”
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28 GHz one-sided directional slot array antenna for 5G application by Ide, Takuhiro, Kanaya, Haruichi

“…This paper presents a design of one-sided directional slot array antenna for 28 GHz-band 5G application. The antenna element is composed of top metal,…”
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Superconducting TiN through-silicon-vias for quantum technology by Grigoras, K., Simbierowicz, S., Gronberg, L., Govenius, J., Vesterinen, V., Prunnila, M., Hassel, J.

“…Through-silicon vias (TSVs) can be used to route signals and to obtain effective grounding in microwave circuits. The coating of the TSVs with a…”
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Interfacial Microstructure Evolution for Cu/Cu3Sn/Cu Solder Joints during Ultrasonic-Assisted TLP Soldering Process by Han, Xu, Li, Xiaoyan, Yao, Peng, Chen, Dalong

“…In this study, the interfacial microstructure evolution and mechanism of ultrasonic action during ultrasonic-assisted TLP soldering process (260°C, 600W,…”
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High Density RDL build-up on FO-WLP using RDL-first Approach by Ho, Soon Wee, Hsiang-Yao, Hsiao, Lim, Simon Siak Boon, Choong, Chong Ser, Siang, Sharon Lim Pei, Chong, Chai Tai

“…FO-WLP based on RDL-first integration flow with 8 metal layers in a single side was proposed and demonstrated to meet advanced, high density applications for…”
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Innovative EMI Shielding Solutions on Advanced SiP Module for 5G Application by Tsai, Mike, Chiu, Ryan, He, Eric, Chen, J. Y., Chu, Frank, Tsai, Jensen, Wang, Yu-Po, Jian, Shunyu, Chen, Simon

“…Recently, the high growing semiconductor is the Internet of Things (IoT) and fifth generation (5G) connectivity application. Based on 5G, the different working…”
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Best Engineering Practices to Establish Cooling Limit for 375W Add-in PCI-e Center Accelerator Card with Active Optical by Refai-Ahmed, Gamal, Philofsky, Brian, Gektin, Vadim, Sammakia, Bahgat, Do, Hoa, Rangarajan, Srikanth

“…There are many widely available heat transfer technologies that use forced air and vapor chambers to solve thermal problems up to 40 Watts/cm 2 . The chart in…”
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