Search Results - "2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)"
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1
Analysis of current carrying capacity of silver-based conductive pastes for PCB repair
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…This paper presents some investigations on the current carrying capabilities of PCB traces repaired with silver-based conductive paste. Such PCB traces with…”
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Conference Proceeding -
2
A real-time webcam based Eye Ball Tracking System using MATLAB
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…Eye Ball Tracking System is a device which is intended to assist patients that cannot perform any voluntary tasks related to daily life. Patients who only can…”
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Conference Proceeding -
3
Using GitHub in the classroom - a collaborative learning experience
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…The most important skills employers are looking for in engineering are creativity, ability to work in teams and critical thinking. However the most used…”
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Conference Proceeding -
4
Investigating mechanical performance of PLA and CA biodegradable printed circuit boards
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…The paper presents a set of experiments investigating the mechanical performance of PCBs manufactured from biodegradable, sustainable polymers, compared to…”
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Conference Proceeding -
5
Study of thermal ageing of polypropylene film capacitors
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…Polypropylene film capacitors manufactured by five different manufacturers were aged at the temperature of 100 °C for 1600 hours. Changes of the capacitance,…”
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Conference Proceeding -
6
Accurate modeling of supercapacitors for DC operation regime
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…Supercapacitors or Electrochemical Double Layer Capacitors (EDLC) have been intensively studied in the last years for promising applications in vehicle…”
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Conference Proceeding -
7
Low computational method for siren detection
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…A driving assistance system which can detect the sound produced by sirens and warn the driver has indisputable advantages: diminishes the numbers of accidents…”
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8
Designing of microcontroller based Syringe Pump with variable and low delivery rates for the administration of small volumes
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…Delivering medications and fluids intravenously is a common practice in modern medical procedures. Administering medications or fluids directly into a…”
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9
Comparative assessment of maxwell and Helmholtz coils magnetic field for biotechnological applications
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…The studies regarding magnetic field (MF) biotechnological applications in the range of Extremely Low Frequency (ELF: 3Hz to 300Hz, ITU Recommendation V.431-7)…”
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10
Challenges and solutions for advanced sensing of water infrastructures in urban environments
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…Our hypothesis is that in order to extract relevant information from a sensor network placed to monitor or control urban behavior, the data received has to be…”
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11
SCADA development for an islanded microgrid
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…The aim of this paper is to describe a SCADA tool for an intelligent microgrid. This application provides control over a smart microgrid that contains…”
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Conference Proceeding -
12
Research and development of a system for measuring electrical parameters of EDLC
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…The batteries used to store electricity in industrial applications or electric vehicles sold so far have the disadvantage of a limited number of charge /…”
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13
Weekly electronic pills dispenser with circular containers
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…This paper proposes the improvement of the process of health recovery by using a programmable medication dispenser. We designed and realized an electronic…”
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14
High speed and secure variable probability Pseudo/True Random Number Generator using FPGA
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…Random numbers generators are widely used in different fields like cryptography, gaming development, artificial intelligence, etc. Being the engine of some…”
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15
Pupil detection algorithms for eye tracking applications
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…In this paper two pupil detection algorithms (based on Starburst and circular Hough transform) for the eye tracking application are presented. The operation of…”
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16
Hardware and software designing of USB based plug n play data acquisition device with C# and LabView compatibility
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…As interdisciplinary sciences getting popular with every passing day, the need of electronic devices interfacing with a PC is also increasing. Very useful…”
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17
Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…We present our results on the analysis of electrical performance of Flip-Chip bonded thin Silicon chip-on-foil assemblies during bending. A custom made bending…”
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18
High-frequency power loss investigation of a planar ferrite core transformer
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…Nowadays, due to the magnetic materials technology progress new design solutions are provided to engineers in order to develop new supply systems using power…”
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19
Semantic data aggregation in heterogeneous learning environments
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…The Internet of Things paradigm is gaining momentum as the number of interconnected devices is continually increasing. The paper approaches the…”
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20
VIBROGEN - An experimental system to study vibration waveforms generated by faults under arbitrary load conditions
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…An electronic experimental system is built in order to generate and record mechanical vibrations in controlled conditions, loads and faults. Mechanical faults…”
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Conference Proceeding