Search Results - "2012 13th International Conference on Electronic Packaging Technology & High Density Packaging"

Thermal analysis of phosphor in high brightness LED by Ye, H., Sau Koh, Yuan, C. A., Zhang, G. Q.

“…The drive to increased electrical currents input to achieve high lumen for Light Emitting Diode (LED) hasled to a series of thermal problems. Hence, thermal…”
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High temperature resistant joint technology for SiC power devices using transient liquid phase sintering process by Fengqun Lang, Yamaguchi, H., Nakagawa, H., Sato, H.

“…A high temperature resistant joint technology for bonding SiC power devices is developed using a transient liquid phase sintering (TLPS) process with a paste…”
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An effective prediction method for LED lumen maintenance by Fan, H. B., Li, X. P., Shen, J. X., Chen, M.

“…IES LM-80-08/Energy Star, as an accepted method for LED life testing, requires LED be operated under three temperatures for at least 6000 hours to claim the…”
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Simulation and modeling of wafer level silicon-base spiral inductor by Bian, Xinhai, Guo, Hongyan, Zhang, Li, Tan, KH, Lai, CM

“…With the development of radio frequency wireless communication technology, there are strong demands of spiral inductor with high performance and low profile…”
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Reliability and failure analysis of Lithium Ion batteries for electronic systems by Williard, N., Wei He, Osterman, M., Pecht, M.

“…This paper presents an investigation into the reliability and physical degradation mechanisms associated with the loss of battery performance. Cells from two…”
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Mechanism of low temperature Cu-In Solid-Liquid Interdiffusion bonding in 3D package by Yanhong Tian, Ning Wang, Yang Li, Chunqing Wang

“…Three-dimensional (3D) integrated circuit (IC) packaging technology is under rapid development to realize high-density and high-speed transmission, and through…”
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Angular color uniformity improvement for phosphor-converted white light-emitting diodes by optimizing remote coating phosphor geometry by Huai Zheng, Xing Fu, Run Hu, Sheng Liu, Xiaobing Luo

“…Angular color uniformity (ACU) of a king of popular remote phosphor coating LED packaging with spherical phosphor shape with uniform thickness was invested by…”
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FEA study of the evolution of wafer warpage during reflow process in WLP by Chunsheng Zhu, Wenguo Ning, Jiaotuo Ye, Gaowei Xu, Le Luo

“…In this paper, the evolution of wafer warpage during reflow process in wafer level packaging (WLP) is investigated by finite element analysis (FEA). The…”
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Angular color uniformity enhancement of phosphor converted white LEDs integrated with compact modified freeform TIR components by Shuiming Li, Kai Wang, Fei Chen, Shuang Zhao, Zhili Zhao, Sheng Liu

“…Total Internal Reflection (TIR) lenses are optical components which are used to collimate the light. Desired uniform illumination within a limited beam angle…”
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Decapsulation methods for Cu interconnection packages by Xiaosong Ma, Yang, D. G., Zhang, G. Q.

“…Decapsulation is the process of removing mold compound from the die surface of a plastic encapsulated device. Typically, the mold compound is removed only in…”
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A method to design freeform lens for uniform illumination in direct-lit led backlight with high distance-height ratio by Run Hu, Huai Zheng, Chuangang Ji, Sheng Liu, Xiaobing Luo

“…In this study, a method based on the definition of illuminance was presented to design freeform lens for uniform illumination in direct-lit light emitting…”
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The development of low cost Through Glass Via (TGV) interposer using additive method for via filling by Yu Sun, Daquan Yu, Ran He, Fengwei Dai, Xiaofeng Sun, Lixi Wan

“…Through Glass Via (TGV) is a new approch for Three-dimensional (3D) integration packaging. In this paper, a novel low cost process for manufacture TGV wafer…”
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Effect of additives on copper electroplating profile for TSV filling by Yunhui Zhu, Yuan Bian, Xin Sun, Shenglin Ma, Qinghu Cui, Xiao Zhong, Jing Chen, Min Miao, Yufeng Jin

“…3D integration with TSVs is emerging as a promising technology for the next generation integrated circuits. TSV filling is a critical process in TSV…”
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Random vibration simulation and analysis of PoP solder joints with different structure parameters by Tang Haili, Wu Zhaohua, Lui Zhengwe

“…This paper aims to examine the effect of relative structure parameter on stress under random vibration. Firstly, the PoP device and PCB was modeled by using…”
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Comparison of copper, silver and gold wire bonding on interconnect metallization by Hu Guojun

“…Wire bonding technology has been extensively used to interconnect IC chips and substrates. Gold (Au) and aluminium (Al) has been used for wire bonding…”
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Determination of driving current of RGB LEDs for white light illumination by Huishan Zhao, Lee, S. W. Ricky

“…The relationship between the driving current of RGB LED chips and the color temperature of the produced white light was investigated. A simple method was…”
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Rapid thermal cycling by eddy current inducted heating on optical property and thermostability of high power LED by Jibing Chen, Wei Guo, Yinong Liu, Wenfei Zhang, Bing An, Yiping Wu

“…The effect of rapid thermal cycling by eddy current inducted heating on optical property and thermostability of high power light emitting diode(LED)is…”
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Research on LED temperature characteristic and thermal analysis at low temperatures by Yu Guo, Kai-lin Pan, Guo-tao Ren, Shu-jing Chen, Fei Yuan

“…LED with the advantages of high brightness, long-lifetime, energy-saving and environmental protection is widely used in varieties of fields especially the…”
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Highly accelerated life testing of LED luminaries by Cai, M., Chen, W. B., Liang, L. L., Gong, M., Tian, W. C., Tang, H. Y., Koh, S., Yuan, C. A., Zhang, Z., Zhang, G. Q., Yang, D. G.

“…With rapid development of lighting emitting diode (LED) market, more people are focusing on reliability testing method of LED luminaries system. Based on the…”
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Reliability assessment for LED luminaires based on Step-Stress Accelerated Life Test by Ming Gong, Xiaosong Ma, Daoguo Yang, Miao Cai, Zhen Zhang, Rongbin Ren, Yu Yang

“…LED luminaires have the characteristics of high reliability and long life-time and it is difficult to be evaluation of reliability. In order to assess the…”
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