Search Results - "2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference"

The development and application of ultra thin copper foil by Lie, Y M, Huang, C C, Tsao, P Y, Lira, S C, Chen, K C

“…The aim of this study is to introduce the development and application of the ultra copper foil of Nan Ya Plastics Corp. The structure of the NY ultra thin…”
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Metal-to-metal bonding technology for MEMS application by Yen, S F, Lin, W S, Hsu, C Y, Lin, J Y

“…Summary form only given. Accompanying of MEMS sensor using in consumer production widely, system in package (SiP) technology becomes popular to integrate CMOS…”
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Impact 2010 - Paper US052 by Marshall, John A

“…It is seen that a number of instances where the typical OA (oxide alternative) dark brown coating has turned red during lamination, typically with DICY…”
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Global outlook for embedded device packaging by Bauer, C E, Neuhaus, H J

“…Embedding active devices in the circuit board offers improved performance by cutting interconnect parasitics, reliability gains by eliminating wire-bonds and…”
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Numerical study on thermal management of high power LED die bonding technology by Chung-Jen Chang, Ming-Tsung Hung

“…Thermal management of high power LED packages is crucial to realize a reliable lighting performance. It is known that the die attach materials acts as a…”
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Reflow behavior of Mo nanoparticle added Sn-3.8Ag-0.7 Cu solder by Arafat, M M, Haseeb, A S M A, Johan, M R

“…Summary form only given. This work investigates the reflow behavior of lead-free Sn-3.8Ag-0.7Cu solder on Cu substrate in the presence of Mo nanoparticles up…”
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Nanofiber based composites for thermal management by Johan Liu, Carlberg, Björn

“…Since the invention of the integrated circuit increasing transistor integration density has been the main path to increased performance of microelectronic…”
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A novel low lose material with thermal reliability for high frequency application by Lee, G, Lin, J

“…Summary form only given. The trend for small form factor in electronic devices and systems is driving circuit industry to develop thinner, lighter, smaller…”
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A novel highly thermal reliable halogen-free system for copper clad laminates by Mel Ling Chen, Chin Hong Chen, Chi Cheng Chen

“…The developing trend for the high performance electronic devices still focuses on light, thin, short and small exhibiting high heat resistance and…”
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A study of measurement methodologies for the loss characteristics of laminates and the effects of laminate features on loss-reduction for high frequency circuit applications by Liang, Peter

“…Summary form only given. The prediction of dielectric loss for laminate materials in high frequency applications has become more important as clock speed…”
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Fast and power efficient 16×16 Array of Array multiplier using Vedic Multiplication by Gurumurthy, K S, Prahalad, M S

“…This paper discusses about "Array of Array" multiplier which is a derivative of Braun Array Multiplier. Braun array are much suitable for VLSI implementation…”
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The doable side shiny copper foil for lithium secondary batteries by Chen, C L, Lin, S C, Chen, K C

“…This study is focused on the characteristic of copper foil for lithium secondary battery application. As a current collector of negative electrode, not only…”
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Thermal stresses and deformations of Cu pillar flip chip BGA package: Analyses and measurements by Jhou, J R, Tsai, M Y, Wu, C Y, Chen, K M

“…When the flip-chip packaging has been moving to the lead-free, fine-pitch and high-current-density packaging, the flip chip with copper-pillar-bump…”
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Temperature effects on electromigration behavior of solder joints by Jia-Hong Ke, Kao, C R

“…Void formation, intermetallic compound dissolution and metallization consumption at cathode interface are major degradation processes of electromigration in…”
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The challenges of copper wire bonding by Lu, Charlie Tsung-hsing

“…Advantages of Cu wire bonding, such as less wire sweep, better performance for analog devices, are interpreted by its material properties. Alternative aspect…”
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Thermo-mechanical analysis of thermoelectric modules by Sheng-Liang Li, Chun-Kai Liu, Chung-Yen Hsu, Ming-Che Hsieh, Ming-Ji Dai, Sheng-Tsai Wu

“…The present paper studies the thermo-mechanical performance of thermoelectric modules by utilizing the Finite Element Analysis FEA simulation software ANSYS. A…”
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Warpage and curvature determination of PCB with DIMM socket during reflow process by strain gage measurement by Huang, P S, Lin, Y H, Huang, C Y, Tsai, M Y, Huang, T C, Liao, M C

“…The purpose of this study is to in-situ measure the warpage of the PCB with surface-mount dual in-line memory module (DIMM) sockets during reflow process by…”
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Development of 30 μm pitch Cu/Ni/SnAg micro-bump-bonded chip-on-chip (COC) interconnects by Jing-Ye Juang, Su-Tsai Lu, Chau-Jie Zhan, Su-Ching Chung, Chia-Wen Fan, Jong-Shiou Peng, Tai-Hong Chen

“…In this study, the assembly processes and reliability performance of interconnects with 30 μm pitch Cu/Ni/SnAg joints are evaluated, Plasma was treated on the…”
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Reliability assessment of stretchable interconnects by Yung-Yu Hsu, Dimcic, Biljana, Gonzalez, Mario, Bossuyt, Frederick, Vanfleteren, Jan, De Wolf, Ingrid

“…In this paper, we comprehensively investigate the fatigue life and the failure modes of horseshoe-patterned stretchable interconnects, through both…”
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Vapor chamber in high power LEDs by Jung-Chang Wang, Chun-Ling Huang

“…The vapor chamber has already been confirmed that its anti-gravity, high effective thermal conductivity and suited on the high heat flux of heat source as the…”
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