Search Results - "2008 International Symposium on Semiconductor Manufacturing (ISSM)"

Monitoring and managing system of equipment operation status by using detailed event log data extracted from exposure tool by Ikeda, Masatoshi, Nishimura, Hidetaka, Takahashi, Ichiro, Ibe, Yukio

“…In order to keep semiconductor manufacturing equipment operating stably, visualizing the basic operating status of the tools is an essential aspect of control…”
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Accelerating R&D learning: Cycle time reduction of a Technology Development (TD) fab by Zhang, Mike, Howard, Dylan

“…With the increasing pressure of time-to-market, Cycle Time (CT) reduction of the semiconductor industry becomes more and more important. Many literatures have…”
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300mm wafer stain formation by Spin Etching by Sato, Keisuke, Mashimoto, Satomi, Watanabe, Masaharu

“…Stain film (Porous Silicon Layer) is formed by Spin Etching at room temperature. It is formed on single side of a wafer. It has a potential an insulation layer…”
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Yield enhancement through new solutions for queue time containment by Favre, Arnaud, Bounouar, Julien, Rioufrays, Sylvain, Andre, Sandrine, Courouble, Kristell, Decamps, Pascal, Rojat, Marilyn, Houe, Jean-Francois, Trenteseaux, Frederique

“…Airborne molecular contamination (AMC) is responsible for crystalline defects and has an impact on final yield for 300 mm CMOS sub 90nm technology. In this…”
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TLS-Dicing - the way to higher yield and throughput by Zuehlke, H.-U., Eberhardt, Gabriele, Mende, Patrick

“…The Thermal-Laser-Separation (TLS) separates brittle materials by well known basic principles with laser induced thermo mechanical stress. TLS-Wafer-dicing is…”
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Keynote speeches

“…Provides an abstract for each of the keynote presentations and a brief professional biography of each presenter. The complete presentations were not made…”
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ISSM 2008 sponsoring organizations

“…JSAP was established as an official academic society in 1946, and since then, it has been a leading academic society in Japan. The society's interests cover a…”
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Defect reduction in advanced lithography processes using a new dual functionality filter by Wu, Aiwen, Chow, Wailup

“…Lower defect densities are required for advanced lithography processes. A new photochemical filtration technology using a nonsieving membrane on the upstream…”
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Method and system for determining optimal wafer sampling in real-time inline monitoring and experimental design by Susan Sun, Johnson, Kari

“…This paper describes a method and system based on weighted objectives to determine optimal wafer sampling for maximum coverage of the various process scenarios…”
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From simulation to characterization - integrated approach for Self Aligned Double Patterning defectivity by Conley, Amiad, Meshulach, Doron, Gichon, Guy, Dolev, Ido, Perlovitch, Renana, Landwer, Niv, Ngai, Chris, Man-Ping Cai, Liyan Miao

“…SADP (Self Aligned Double Patterning) is one of the major options to be implemented to bridge the lithography resolution gaps for 40 nm half pitch nodes and…”
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Timed Move Command for improved on-time AMHS delivery by Lubke, Jorg, Honold, Alfred

“…This paper introduces the concept of Timed Move Command used in the AMHS Control System as a method to meet on-time delivery requirements of equipment in a…”
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A novel filter rating method for less than 30 nm particle by Mizuno, Takehito, Namiki, Akihisa, Tsuzuki, Shuichi, Numaguchi, Toru

“…This paper describes a novel filter rating method beyond the current 30 nm limit by combining dynamic light scattering (DLS) and ICP-MS technique, and proposes…”
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BEOL parametric variation control with FDC data by Matsuhashi, Hideki, Bai, Jenny, Xie, Weldom, Fernandez, Patrick, Ngo, Luong, Huron, Gilles, Herndon, Michael, Besnard, Jerome, Williamson, Mike, Graves, Spencer, Akiya, Nobuchika, Yu, Michael, Jensen, Jim

“…Parametric variation control was simulated using key FDC sensors identified through multivariate modeling of Back End Of Line (BEOL) process equipment in a…”
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In-line material analysis of 50nm defects by integration of Energy (EDX) and Wavelength (WDX) Dispersive X-ray analysis by Levin, Lior, Eilon, Michal, Porat, Ronnie, van der Sijs, Arjan, Stegen, Raf, van Brederode, Erik

“…The rapid adoption of new materials at advanced semiconductor technology nodes enhances the need for an in-line comprehensive elemental analysis of extremely…”
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Manual Material Handling System by Wen Cheng Chen, Chiou, Noah, Lu, J.Y., Yeh, Jonathan, Kuan, Jessica

“…In the semiconductor manufacturing industry, wafers are transported from machine to machine via Automatic Material Handling System (AMHS) without human…”
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A Scanner Throughput Monitoring System (STMS) for continuously improving litho-cluster productivity by Wei Tai Chen, Pin Chun Lin, Ta Wei Wu

“…The litho-cluster is the main manufacturing equipment in a semiconductor Fab. Manufacturers have difficulty in clarifying the root cause of productivity…”
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Knowledge sharing and creation in the semiconductor equipment industry by Moriya, Tsuyoshi, Benton, Caroline

“…The sharing of tacit knowledge is difficult. Even among engineers, the sharing of key knowledge during product development can be an extremely arduous and…”
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Exploratory study on emerging integrator business model in engineering chain of the semiconductor industry: Re-integration of vertical disintegration by Yea-Husy Su, Ruey-Shan Guo, Chia-Wen Lo, Dain-Xuan Kao

“…This study attempts to explore the possible new business model in the engineering chain of the semiconductor industry to overcome the challenges of the trend…”
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Advanced endpoint detection tool of NF3 remote plasma cleaning by Fujii, Kazuyuki, Hanazaki, Minoru, Kawaharada, Gen, Katayama, Katsuo, Komemura, Toshio, Taki, Masakazu, Tuda, Mutumi

“…We have developed an advanced endpoint detection (EPD) tool of NF3 remote plasma cleaning for CVD chambers in order to improve cleaning condition, or manage…”
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Impacts of small lot manufacturing on AMHS by Kondo, Hiroshi

“…Demands to reduce semiconductor fab lot cycle time are increasing more and more. Small lot manufacturing (SLM) is proposed as a promising way to reduce cycle…”
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